Freescale Semiconductor MPC8260 - Manual (Page 73)

MPC8260 PowerQUICC II Family Reference Manual, Rev. 2
Freescale Semiconductor lxxi
Tables
Table
Number
Title
Page
Number
27-17 SMC GCI Parameter RAM Memory Map ......................................................................... 27-31
27-18 SMC GCI Commands ......................................................................................................... 27-32
27-19 SMC Monitor Channel RxBD Field Descriptions .............................................................. 27-33
27-20 SMC Monitor Channel TxBD Field Descriptions .............................................................. 27-33
27-21 SMC C/I Channel RxBD Field Descriptions ...................................................................... 27-34
27-22 SMC C/I Channel TxBD Field Descriptions ...................................................................... 27-34
27-23 SMCE/SMCM Field Descriptions ...................................................................................... 27-35
28-1 Global MCC Parameters ....................................................................................................... 28-4
28-2 Channel-Specific Parameters for HDLC............................................................................... 28-6
28-3 TSTATE High-Byte Field Descriptions ................................................................................ 28-7
28-4 CHAMR Field Descriptions.................................................................................................. 28-9
28-5 RSTATE High-Byte Field Descriptions ............................................................................. 28-10
28-6 Channel-Specific Parameters for Transparent Operation.................................................... 28-11
28-7 CHAMR Field Descriptions—Transparent Mode .............................................................. 28-13
28-8 CES-Specific Global MCC Parameters ............................................................................. 28-15
28-9 CHAMR Field Descriptions—CES Mode .......................................................................... 28-16
28-10 Channel-Specific Parameters for SS7 ................................................................................. 28-19
28-11 ECHAMR Fields Description ............................................................................................. 28-22
28-12 Parameter Values for SUERM in Japanese SS7.................................................................. 28-24
28-13 SS7 Configuration Register Fields Description .................................................................. 28-24
28-14 Channel Extra Parameters ................................................................................................... 28-28
28-15 MCCF Field Descriptions ................................................................................................... 28-33
28-16 Group Channel Assignments .............................................................................................. 28-34
28-17 MCC Commands................................................................................................................. 28-35
28-18 MCCE/MCCM Register Field Descriptions ....................................................................... 28-37
28-19 Interrupt Circular Table Entry Field Descriptions .............................................................. 28-39
28-20 GUN Error Recovery—.29
µm (HiP3) Rev A.1 and B.2 Silicon........................................ 28-42
28-21 GUN Error Recovery—.29
µm (HiP3) Rev B.3 and Subsequent Silicon ........................... 28-43
28-22 RxBD Field Descriptions .................................................................................................... 28-44
28-23 TxBD Field Descriptions .................................................................................................... 28-46
29-1 Internal Clocks to CPM Clock Frequency Ratio .................................................................. 29-3
29-2 GFMR Register Field Descriptions....................................................................................... 29-4
29-3 FTODR Field Descriptions ................................................................................................... 29-9
29-4 FCC Parameter RAM Common to All Protocols except ATM........................................... 29-12
29-5 FCRx Field Descriptions..................................................................................................... 29-14
30-1 ATM Service Types............................................................................................................... 30-9
30-2 External CAM Input and Output Field Descriptions .......................................................... 30-14
30-3 Field Descriptions for Address Compression ..................................................................... 30-16
30-4 VCOFFSET Calculation Examples for Contiguous VCLTs ............................................... 30-16
30-5 VP-Level Table Entry Address Calculation Example......................................................... 30-17
30-6 VC-Level Table Entry Address Calculation Example ........................................................ 30-18