Motorola ColdFire MCF5281 - Manual (Page 683)

Mechanical Data
Freescale Semiconductor 32-9
Figure 32-3. 256 MAPBGA Package Dimensions
32.2 Ordering Information
Table 32-2. Orderable Part Numbers
Freescale Part
Number
Description Package Speed Temperature
MCF5214CVF66 MCF5214 RISC Microprocessor 256 MAPBGA 66.67 MHz -40
°
to +85
°
C
MCF5216CVF66 MCF5216 RISC Microprocessor 256 MAPBGA 66.67 MHz -40
°
to +85
°
C
MCF5280CVF66 MCF5280 RISC Microprocessor 256 MAPBGA 66.67 MHz -40
°
to +85
°
C
MCF5280CVF80 MCF5280 RISC Microprocessor 256 MAPBGA 80 MHz -40
°
to +85
°
C
MCF5281CVF66 MCF5281 RISC Microprocessor 256 MAPBGA 66.67 MHz -40
°
to +85
°
C
MCF5281CVF80 MCF5281 RISC Microprocessor 256 MAPBGA 80 MHz -40
°
to +85
°
C
MCF5282CVF66 MCF5282 RISC Microprocessor 256 MAPBGA 66.67 MHz -40
°
to +85
°
C
MCF5282CVF80 MCF5282 RISC Microprocessor 256 MAPBGA 80 MHz -40
°
to +85
°
C
NOTES:
1.
DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND
TOLERANCES PER ASME Y14.5M, 1994.
3. DIMENSION b IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER,
PARALLEL TO DATUM PLANE Z.
4. DATUM Z (SEATING PLANE) IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. PARALLELISM MEASUREMENT SHALL
EXCLUDE ANY EFFECT OF MARK ON TOP
SURFACE OF PACKAGE.
X
Y
D
E
LASER MARK FOR PIN A1
IDENTIFICATION IN
THIS AREA
0.20
METALIZED MARK FOR
PIN A1 IDENTIFICATION
IN THIS AREA
M
M
3
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
1 2 3 4 5 6 7 10 11 12 13 14 15 16
e 15X
e 15X
b 256X
M 0.25 Y Z
M 0.10
X
Z
S
DETAIL K
VIEW M-M
ROTATED 90 CLOCKWISE
°
S
A
Z Z
A2
A1
4
0.15
Z 0.30
256X
5
K
DIM Min Max
Millimeters
A 1.25 1.60
A1 0.27 0.47
A2 1.16 REF
b 0.40 0.60
D 17.00 BSC
E 17.00 BSC
e 1.00 BSC
S 0.50 BSC
MCF5282 and MCF5216 ColdFire Microcontroller User’s Manual, Rev. 3