6 self-refresh operation, 6 self-refresh operation -16 – Motorola ColdFire MCF5281 User Manual
Page 288
Synchronous DRAM Controller Module
15-16
Freescale Semiconductor
shows the auto-refresh timing. In this case, there is an SDRAM access when the refresh
request becomes active. The request is delayed by the precharge to
ACTV
delay programmed into the active
SDRAM bank by the CAS bits. The
REF
command is then generated and the delay required by
DCR[RTIM] is inserted before the next
ACTV
command is generated. In this example, the next bus cycle
is initiated, but does not generate an SDRAM access until T
RC
is finished. Because both chip selects are
active during the
REF
command, it is passed to both blocks of external SDRAM.
Figure 15-8. Auto-Refresh Operation
15.2.3.6
Self-Refresh Operation
Self-refresh is a method of allowing the SDRAM to enter into a low-power state, while at the same time
to perform an internal refresh operation and to maintain the integrity of the data stored in the SDRAM. The
DRAM controller supports self-refresh with DCR[IS]. When IS is set, the
SELF
command is sent to the
SDRAM. When IS is cleared, the
SELFX
command is sent to the DRAM controller.
shows the
self-refresh operation.
A[23:0]
SRAS
SCAS
DRAMW
PALL
SDRAM_CS[0] or [1]
REF
ACTV
t
RCD
= 2
t
RC
= 6
CLKOUT
MCF5282 and MCF5216 ColdFire Microcontroller User’s Manual, Rev. 3