NXP Semiconductors LPC24XX UM10237 - Manual (Page 7)

UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 7 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
5.3 LPC2468 ordering options
5.4 LPC2470 ordering options
Table 6. LPC2420/60 ordering options
Type number Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHCI/
DEV
+ 4 kB
FIFO
C
AN cha
n
nels
SD/
MMC GP
DMA
A
DC cha
n
nels
D
AC cha
n
nels
Temp
range
Loc
a
l bu
s
Ethernet buffer GP/USB RT
C
To
ta
l
LPC2420FBD208 N/A 64 - 16 2 82 Full 32-bit - yes - yes yes 8 1
−40 °C to
+85
°C
LPC2460FBD208 N/A 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1
−40 °C to
+85
°C
LPC2460FET208 N/A 64 16 16 2 98 Full 32-bit MII/RMII yes 2 yes yes 8 1
−40 °C to
+85
°C
Table 7. LPC2468 ordering information
Type number Package
Name Description Version
LPC2468FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28
Ч 28 Ч 1.4 mm
SOT459-1
LPC2468FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm SOT950-1
Table 8. LPC2468 ordering options
Type number Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
CA
N c
h
annels
SD/
MMC GP
DMA
AD
C c
h
annels
DA
C c
h
annels
Temp
range
Lo
ca
l bu
s
Ethe
rne
t buf
fer
GP/
U
S
B
RTC To
ta
l
LPC2468FBD208 512 64 16 16 2 98 Full 32-bit MII/
RMII yes 2 yes yes 8 1
−40 °C to
+85
°C
LPC2468FET208 512 64 16 16 2 98 Full 32-bit MII/
RMII yes 2 yes yes 8 1
−40 °C to
+85
°C
Table 9. LPC2470 ordering information
Type number Package
Name Description Version
LPC2470FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28
Ч 28 Ч 1.4 mm
SOT459-1
LPC2470FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15
Ч 15 Ч
0.7 mm
SOT950-1