NXP Semiconductors LPC24XX UM10237 - Manual (Page 6)

UM10237_4 © NXP B.V. 2009. All rights reserved.
User manual Rev. 04 — 26 August 2009 6 of 792
NXP Semiconductors
UM10237
Chapter 1: LPC24XX Introductory information
• Boundary scan for simplified board testing.
• Versatile pin function selections allow more possibilities for using on-chip peripheral
functions.
4. Applications
• Industrial control
• Medical systems
• Protocol converter
• Communications
5. Ordering options
5.1 LPC2458 ordering options
5.2 LPC2460 ordering options
Table 3. LPC2458 ordering information
Type number Package
Name Description Version
LPC2458FET180 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm SOT570-2
Table 4. LPC2458 ordering options
Type number Flash
(kB) SRAM (kB) External
bus Ethernet USB
OTG/
OHC/
DEV
+ 4 kB
FIFO
CAN channels
SD/
MMC GP
DMA
ADC channels DAC channels
Temp
range
Lo
cal
bu
s
Et
hernet buffer
GP/
U
SB
RTC To
ta
l
LPC2458FET180 512 64 16 16 2 98 16-bit MII/
RMII yes 2 yes yes 8 1
−40 °C to
+85
°C
Table 5. LPC2420/60 ordering information
Type number Package
Name Description Version
LPC2420FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28
Ч 28 Ч 1.4 mm
SOT459-1
LPC2460FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28
Ч 28 Ч 1.4 mm
SOT459-1
LPC2460FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15
Ч 15 Ч 0.7 mm SOT950-1