Renesas H8S/2111B - Manual (Page 573)

Rev. 1.00, 05/04, page 539 of 544
C. Package Dimensions
For package dimensions, dimensions described in Renesas Semiconductor Packages Data Book
have priority.
Package Code
JEDEC
EIAJ
Weight (reference value) TFP-144
—
Conforms
0.6 g
Unit: mm
*Dimension including the plating thickness
Base material dimension
108 73
1 36
0 ˚ – 8˚
0.08
0.07 M
18.0 ± 0.2
72
144
109
37
18.0 ± 0.2
* 0.18 ± 0.05
0.4
1.20 Max
1.0
0.5 ± 0.1
16
1.00
0.10 ± 0.05
*
0.17 ± 0.05
0.16 ± 0.04
0.15 ± 0.04
1.0
Figure C.1 Package Dimensions (TFP-144)