INFICON IC6 Thin Film Deposition Controller User Manual

Thin film deposition controller

Table of contents

Document Outline

Cover Page
Title Page
Trademarks
Disclaimer
Copyright
Declaration Of Conformity
Warranty
Table Of Contents
Chapter 1 Introduction and Specifications
- 1.1 Introduction
  - 1.1.1 Related Manuals
- 1.2 IC6 Safety
- 1.3 How To Contact INFICON
  - 1.3.1 Returning Your IC6
- 1.4 IC6 Specifications
- 1.5 Unpacking and Inspection
- 1.6 Parts and Options Overview
- 1.7 Initial Power-On Verification
Chapter 2 Installation and Interfaces
- 2.1 Location Guidelines
- 2.2 Avoiding Electrical Interference
- 2.3 Connecting the Controller
  - 2.3.1 Routing XIU Cables
  - 2.3.2 Interface Cable Fabrication and Pin-Out
Chapter 3 Operation
- 3.1 Front Panel Controls
- 3.2 Rear Panel Interfaces
- 3.3 Displays
- 3.4 Process Description
- 3.5 State Descriptions
- 3.6 Special Features
Chapter 4 Sensor & Source Setup
- 4.1 Sensor Setup Introduction
  - 4.1.1 Sensor Display Navigation
  - 4.1.2 Sensor Parameters
- 4.2 Source Setup Introduction
  - 4.2.1 Source Navigation
  - 4.2.2 Source Parameters
- 4.3 DAC Output Selection Rules
Chapter 5 Material Setup
- 5.1 Introduction
Chapter 6 Process Setup
- 6.1 Process Setup Introduction
- 6.2 Overview Page
- 6.3 Curr(ent) Proc(ess) Page
- 6.4 Process Layers 1 - 10 etc.
  - 6.4.1 Layer Parameters
    - 6.4.1.1 Layer Parameter Editing
    - 6.4.1.2 Layer Parameters
- 6.5 Special Layer Parameter Features
  - 6.5.1 Skip Deposit
Chapter 7 General Parameters
- 7.1 General Setup Overview
- 7.2 General Screen Process Page
- 7.3 DACs Page Parameters
- 7.4 COMM Page Parameters
- 7.5 MESSAGE Page Setup
- 7.6 DATE / TIME Set Up
- 7.7 TEST Page Set Up
- 7.8 LOCK Page Code Setup
- 7.9 AUDIO / VISUAL Page Set Up
Chapter 8 Digital I/O
- 8.1 Digital I/O Screen
- 8.2 All Input Page
- 8.3 All Output Page
- 8.4 I/O Board Page
  - 8.4.1 Output Type
Chapter 9 Logic Statement Setup
- 9.1 Logic Statement Overview
- 9.2 Editing the Logic Statements
- 9.3 IF Event Definitions
- 9.4 THEN Action Definitions
- 9.5 Logic Statement Example
Chapter 10 Remote Communications
- 10.1 Remote Communication Configuration Overview
- 10.2 Physical Connections
  - 10.2.1 RS-232C Serial Port
  - 10.2.2 TCP/IP Ethernet Port
    - 10.2.2.1 Network Connection
    - 10.2.2.2 How to Set Up the Network Protocol on the PC
- 10.3 Message Format
  - 10.3.1 Protocol
  - 10.3.2 Data Type Codes
- 10.4 Communication Commands
Chapter 11 Applications
- 11.1 Multiple Sensor Deposition Control
  - 11.1.1 IC6 Parameters and Corrections for Multiple Sensor Operation
- 11.2 Trend Analysis
  - 11.2.1 IC6 Parameters Associated with the Trend Analysis Feature
- 11.3 IC6 Cygnus Emulation
- 11.4 IC6 Four & Six Layer (Cygnus Emulation) Configuration
Chapter 12 Maintenance and Calibration Procedures
- 12.1 Importance of Density, Tooling and Z-Ratio
- 12.2 Determining Density
- 12.3 Determining Tooling
- 12.4 Laboratory Determination of Z-Ratio
- 12.5 AutoTuning
- 12.6 Determining Cross Talk Calibration For Co-Deposition
- 12.7 Source Maintenance
  - 12.7.1 Source Maintenance Parameters
- 12.8 System Status
Chapter 13 Counters & Timers
- 13.1 Introduction
Chapter 14 USB Storage
- 14.1 File Handling (USB)
  - 14.1.1 USB Storage Devices
- 14.2 Directory Structure
- 14.3 Configuration Files
- 14.4 Data Logs
- 14.5 Screen Captures
Chapter 15 Troubleshooting, Status and Error Messages
- 15.1 Status Messages
- 15.2 User Messages
- 15.3 AutoTune and Calibration Messages
- 15.4 STOP messages
- 15.5 Transient Messages
- 15.6 Input Error Messages
- 15.7 Troubleshooting Guide
- 15.8 Replacing the Crystal
- 15.9 Crystal Sensor Emulator IPN 760-601-G1 or 760-601-G2
Chapter 16 Measurement and Control Theory
- 16.1 Basics
Appendix A Material Table
- A.1 Introduction