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Chapter 12 maintenance and calibration procedures, 1 importance of density, tooling and z-ratio, 2 determining density – INFICON IC6 Thin Film Deposition Controller User Manual

Page 243: Chapter 12, Chapter 12, maintenance and calibration procedures, Pter 12, maintenance and calibration procedures

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IC6 Operating Manual

Chapter 12

Maintenance and Calibration Procedures

12.1 Importance of Density, Tooling and Z-Ratio

The quartz crystal microbalance is capable of precisely measuring the mass added
to the face of the oscillating quartz crystal sensor. The IC6's knowledge of the
density of this added material (specified in the density parameter in Material
Set-Up) allows conversion of the mass information into thickness. In some
instances, where highest accuracy is required, it is necessary to make a density
calibration as outlined in

section 12.2

.

Because the flow of material from a deposition is not uniform, it is necessary to
account for the different amount of material flow onto the sensor compared to the
substrates. This factor is accounted for in the tooling parameter in Material Set-Up.
The tooling factor can be experimentally established by following the guidelines in

section 12.3 on page 12-2

.

In the IC6 if the Z-Ratio is not known it could be estimated from the procedures
outlined in

section 12.4 on page 12-3

, or, typically, the Auto-Z function can be used

to determine the Z-Ratio.

12.2 Determining Density

NOTE: The bulk density values retrieved from the Material Library are sufficiently

accurate for most applications.

Follow the steps below to determine density value.

1

Place a substrate (with proper masking for film thickness measurement)
adjacent to the sensor, so that the same thickness will be accumulated on the
crystal and substrate.

2

Set density to the bulk value of the film material or to an approximate value.

3

Set Z-Ratio to 1.000 and tooling to 100%.

4

Place a new crystal in the sensor and make a short deposition
(1000-5000 Å) using manual control.

5

After deposition, remove the test substrate and measure the film thickness with
either a multiple beam interferometer or a stylus-type profilometer.