Bonding multiple subpanels – Rockwell Automation 2094-xMxx-S Kinetix 6000 Multi-axis Servo Drives User Manual User Manual
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Rockwell Automation Publication 2094-UM001H-EN-P - June 2013
Chapter 2
Planning the Kinetix 6000 Drive System Installation
Bonding Multiple Subpanels
Bonding multiple subpanels creates a common low impedance exit path for the
high frequency energy inside the cabinet. If subpanels are not bonded together,
and do not share a common low impedance path, the difference in impedance can
affect networks and other devices that span multiple panels:
• Bond the top and bottom of each subpanel to the cabinet by using
25.4 mm (1.0 in.) by 6.35 mm (0.25 in.) wire braid. As a rule, the wider
and shorter the braid is, the better the bond.
• Scrape the paint from around each fastener to maximize metal-to-metal
contact.
Figure 9 - Multiple Subpanels and Cabinet Recommendations
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)
Paint removed
from cabinet.
Cabinet ground bus
bonded to the subpanel.
Wire Braid
25.4 mm (1.0 in.) by
6.35 mm (0.25 in.)