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Rainbow Electronics DS3170 User Manual

Page 9

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DS3170 DS3/E3 Single-Chip Transceiver

9 of 233

Figure 9-13. DS3 Frame Format................................................................................................................................ 81

Figure 9-14. DS3 Subframe Framer State Diagram .................................................................................................. 81

Figure 9-15. DS3 Multiframe Framer State Diagram................................................................................................. 82

Figure 9-16. G.751 E3 Frame Format ....................................................................................................................... 89

Figure 9-17. G.832 E3 Frame Format ....................................................................................................................... 92

Figure 9-18. MA Byte Format .................................................................................................................................... 92

Figure 9-19. HDLC Controller Block Diagram ........................................................................................................... 97

Figure 9-20. Trail Trace Controller Block Diagram .................................................................................................. 100

Figure 9-21. Trail Trace Byte (DT = Trail Trace Data)............................................................................................. 102

Figure 9-22. FEAC Controller Block Diagram.......................................................................................................... 103

Figure 9-23. FEAC Codeword Format.................................................................................................................... 104

Figure 9-24. Line Encoder/Decoder Block Diagram ................................................................................................ 105

Figure 9-25. B3ZS Signatures ................................................................................................................................. 107

Figure 9-26. HDB3 Signatures................................................................................................................................. 107

Figure 9-27. BERT Block Diagram .......................................................................................................................... 108

Figure 9-28. PRBS Synchronization State Diagram................................................................................................ 110

Figure 9-29. Repetitive Pattern Synchronization State Diagram............................................................................. 111

Figure 9-30. LIU Functional Diagram....................................................................................................................... 112

Figure 9-31. DS3/E3 LIU Block Diagram................................................................................................................. 113

Figure 9-32. Receiver Jitter Tolerance .................................................................................................................... 116

Figure 12-1. JTAG Block Diagram........................................................................................................................... 202

Figure 12-2. JTAG TAP Controller State Machine .................................................................................................. 203

Figure 12-3. JTAG Functional Timing...................................................................................................................... 207

Figure 13-1. DS3170 Pin Assignments—100-Ball CSBGA (Top View) .................................................................. 212

Figure 13-2. DS3170 Pin Assignments—100-Pin LQFP ......................................................................................... 212

Figure 14-1. Mechanical Dimensions—100-Ball CSBGA........................................................................................ 213

Figure 14-2. Mechanical Dimensions—100-Pin LQFP............................................................................................ 214

Figure 17-1. Clock Period and Duty Cycle Definitions............................................................................................. 218

Figure 17-2. Rise Time, Fall Time, and Jitter Definitions ........................................................................................ 218

Figure 17-3. Hold, Setup, and Delay Definitions (Rising Clock Edge) .................................................................... 218

Figure 17-4. Hold, Setup, and Delay Definitions (Falling Clock Edge).................................................................... 219

Figure 17-5. To/From Hi Z Delay Definitions (Rising Clock Edge) .......................................................................... 219

Figure 17-6. To/From Hi Z Delay Definitions (Falling Clock Edge) ......................................................................... 219

Figure 17-7. SPI Interface Timing Diagram ............................................................................................................. 223

Figure 17-8. Micro Interface Nonmultiplexed Read/Write Cycle ............................................................................. 225

Figure 17-9. Micro Interface Multiplexed Read Cycle.............................................................................................. 226

Figure 17-10. DS3 Pulse Mask Template................................................................................................................ 228

Figure 17-11 E3 Waveform Template...................................................................................................................... 229