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Rainbow Electronics DS3164 User Manual

Product preview

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Maxim/Dallas Semiconductor Confidential

Note: This Product Preview contains preliminary information and is subject to change without notice.

PRELIMINARY

PRODUCT BRIEF

PRODUCT BRIEF

Some revisions of this device may incorporate deviations from published specifications known as errata.
Multiple revisions of any device may be simultaneously available through various sales channels. For
information about device errata, visit:

http://dbserv.maxim-ic.com/errata.cfm

.

Rev 1.6

1 of 12

022604


PRODUCT PREVIEW

DS3161,2,3,4 Multi-Port ATM/Packet PHYs For DS3/E3


FEATURES

• Universal PHYs map ATM cells and/or

HDLC packets into DS3 or E3 data streams

• Single, dual, triple and quad-port devices

• UTOPIA 2 or 3 or POS-PHY 2 or 3 interface

with 8, 16, or 32 bit bus width up to 66 MHz

• Ports independently configurable for cell or

packet traffic in POS-PHY bus modes

• Direct, PLCP and clear-channel cell mapping
• Direct and clear-channel packet mapping

• On-chip DS3 (M23 or C-bit) and E3 (G.751

or G.832) framers

• Ports independently configurable for DS3, E3

or arbitrary framing protocol up to 52 Mbps

• Programmable (externally controlled or

internally hardware based engine) subrate
DS3/E3 circuitry

• DS3/E3/PLCP alarm generation and detection

• Built-in HDLC controllers with 256 byte

FIFOs for DS3 PMDL, G.751 Sn bit or G.832
NR/GC bytes

• On-chip BERTs for PRBS and repetitive

pattern generation, detection and analysis

• Full featured DS3/E3/PLCP alarms

• Large performance-monitoring counters for

accumulation intervals up to 1 second

• Flexible overhead insertion/extraction ports

for DS3, E3 and PLCP framers

• Loopbacks include line, diagnostic, framer

payload and system interface

• Ports can be disabled to reduce power








• Integrates clock rate adapter to generate the

required 44.736 MHz for DS3, 34.368 MHz
for E3, and/or 52 MHz for arbitrary framing
protocol up to 52 Mbps

• 8/16-bit generic microprocessor interface

• 3.3V supply with 5V tolerant I/O
• Small high-density Thermally Enhanced (TE)

Chip Scale BGA packaging

• IEEE 1149.1 JTAG test port

www.maxim-ic.com/telecom

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