Rainbow Electronics DS33M33 User Manual
Abridged data sheet
Rev: 111908
ABRIDGED DATA SHEET
DS33M30/DS33M31/DS33M33
Ethernet Over SONET/SDH Mapper
________________________ General Description
The DS33M30 family of products provides a compact
and efficient solution for transporting Gigabit Ethernet
traffic over OC-3/STM-1 optical networks. With the
addition of an optical transceiver, Ethernet PHY,
DDR SDRAM, and host processor, a complete
solution of GbE over OC-3/STM-1 can be
implemented. The family supports Ethernet over
SONET/SDH (EoS) at VC-4, “Next-Generation” EoS
high-order mapping with multiple concatenated
VC-3s, and Ethernet over PDH over SONET/SDH
(EoPoS) with up to three virtually concatenated
DS3/E3 tributaries. The supported frame
encapsulations include GFP-F, HDLC, cHDLC, and
X.86 (LAPS).
_______________________________ Applications
Ethernet Service Delivery Over SONET/SDH
Multiservice Provisioning Platforms (MSPPs)
Transparent LAN Services
LAN Extension
Maxim Integrated Products 1
Some revisions of this device may incorporate deviations from published specifications known as errata. Multiple
revisions of any device may be simultaneously available through various sales channels. For information about device
errata, go to:
www.maxim-ic.com/errata
. For pricing, delivery, and ordering information, please contact Maxim Direct at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
_____________________________________Features
♦ Support for EoS in One STS-3c/VC-4, EoS
Over Up to Three Concatenated STS-1/VC-3s,
and EoPoS Over Up to Three Concatenated
DS-3s
♦ Two Independent 155.52Mbps SerDes Ports
♦ One 10/100/1000 IEEE 802.3 Ethernet MAC
Port
♦ Configurable MII/RMII/GMII MAC Interface
♦ GFP/LAPS/HDLC/cHDLC Encapsulation
♦ IEEE 802.1Q VLAN and Q-in-Q Support
♦ Add/Drop OAM Frames from μP Interface
♦ Quality of Service (QoS) Support
♦ Traffic Policing Through CIR/CBS
♦ Classification Through PCP or DSCP
♦ Supports Up to 512Mb DDR SDRAM Buffer
♦ SPI™ and Parallel Microprocessor Interfaces
♦ 1.8V, 2.5V, 3.3V Supplies
Features continued in Section
.
_________________________ Functional Diagram
VCAT /
LCAS
DS3/E3
Framers
G
FP
/ HDLC / LAP
S
Traffic
Mg
mt
Advance
d
OAM
Etherne
t MAC
High-Order
Mapper
Framer B
3x VC-3
3
SERDES A
DS33M30/M31/M33
3
DS3 ADD/DROP (DS33M33 ONLY)
1 VC-4
SERDES B
SerDes B AND FRAMER B ON
(DS33M31/33 ONLY)
Framer A
______________________________________________________________________________Ordering Information
PART
SUPPORTED EoS/EoPoS
MODES
155Mbps PORTS
EXT. DS3/E3 LINE
PIN-PACKAGE
DS33M30N+
EoS at VC-4
1
No
144 CSBGA
DS33M31N+*
EoS at VC-4,
EoS at 3xVC-3,
EoPoS at 3xDS3
2 No
256
CSBGA
DS33M33N+
EoS at VC-4,
EoS at 3xVC-3,
EoPoS at 3xDS3
2
Yes (3)
256 CSBGA
+Denotes a lead-free/RoHS-compliant package.
*Future product—contact factory for availability.
SPI is a trademark of Motorola, Inc.
Document Outline
- Table of Contents
- 1. General Description and Feature Highlights
- 1.1 Device Feature Overview
- 1.2 TDM Feature Overview
- 1.3 SONET/SDH
- 1.3.1 STS-3/STM-1 SerDes
- 1.3.2 STS-3/STM-1 Framer and Formatter
- 1.3.3 STS-3c/AU-4 Pointer Processing
- 1.3.4 STS-3c SPE/VC-4 Path Termination
- 1.3.5 STS-3 Mux/Demux (DS33M31 and DS33M33 Only)
- 1.3.6 STS-1/AU-3/TU-3 Formatter and Framer (DS33M31 and DS33M33 Only)
- 1.3.7 STS-1/AU-3/TU-3 Pointer Processing (DS33M31 and DS33M33 only)
- 1.3.8 STS-1/VC-3 Path Termination (DS33M31 and DS33M33 only)
- 1.4 PDH (DS33M31 and DS33M33 Only)
- 1.5 Virtual Concatenation (VCAT) (DS33M31 and DS33M33 only)
- 1.6 Encapsulation
- 1.7 Ethernet Feature Overview
- 1.8 SDRAM Interface
- 1.9 Clock Rate Adapter (CLAD)
- 1.10 SPI Serial Microprocessor Features
- 1.11 Parallel Microprocessor Interface (DS33M31 and DS33M33 Only)
- 1.12 Test and Diagnostics
- 2. Standards Compliance
- 3. Applications