Epson S1C33210 - Manual (Page 101)

9 PACKAGE
S1C33210 PRODUCT PART EPSON A-87
9 Package
9.1 Plastic Package
QFP15-128pin
(Unit: mm)
14 ± 0.1
16 ± 0.4
65 96
14
± 0.1
16
± 0.4
33
64
INDEX
0.16
32 1
128
97
1.4
± 0.1
0.1
1.7
max
1
0.5 ± 0.2
0
°
10
°
0.125
0.4
+0.1
–0.05
+0.05
–0.025
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be calculated
from environment temperature (Ta), thermal package resistance (
θ
) and power consumption (P D ).
Chip temperature (Tj) = Ta + (P D
× θ
) (
°
C)
As a guide, normally keep the chip temperature (Tj) lower than 85
°
C.
The thermal resistance of the QFP15-128pin package is as follows:
Thermal resistance (
°
C/W) = 110 to 120
°
C (90 to 100
°
C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has no
air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-cooling
condition.