2 mini-ball grid array – (mbga), Mini-ball grid array – (mbga) -3, Figure 14-2 – Intel STRONGARM SA-1100 User Manual
Page 357: Table 14-2, Package and pinout, Bottom view, Top view side view
SA-1100 Developer’s Manual
14-3
Package and Pinout
14.2
Mini-Ball Grid Array – (mBGA)
shows the SA-1100 256 mini-ball grid array (mBGA) mechanical drawing.
lists the SA-1100 pins in numeric order, showing the signal type for each pin
.
Figure 14-2. SA-1100 256 Mini-Ball Grid Array Mechanical Drawing
A6843-01
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE
AND ITS CONTENTS MAY NOT BE DISCLOSED WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION !.
1.
ALL DIMENSIONS AND TOLERANCES CONFORM
TO ANSI Y14.5M —1982.
2.
DIMENSION IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM
3.
PRIMARY DATUM
AND SEATING PLANE
ARE DEFINED BY THE SPHERICAL CROWNS OF
THE SOLDER BALLS.
4.
ALL DIMENSIONS UNLESS OTHERWISE SPECIFIED
ARE IN MILLIMETERS
– C –
– C –
NOTES:
PIN #1 CORNER
PIN #1
CORNER
A
B
1
3
2
5
4
7
6
9
8
11
10
13
12
740160
01
ENGINEERING RELEASE
02/22/99
DWG. NO.
X
±0.1
XX
±0.05
XXX
±0.030
±1
˚
UNLESS OTHERWISE SPECIFIED
A. ESCIO
D
A
B
C
D
A
B
C
D
1
3
4
5
6
7
8
1
2
3
4
5
6
7
8
34649
740160
01
8/1
SHEET
1
OF
1
256L PBGA CUSTOMER DRAWING
17.00 x 17.00 x 0.36
02/22/99
02/22/99
L. PELCHAT
DIMENSIONS ARE IN MILLIMETERS
TOLERANCE
DECIMALS
MATERIAL
FINISH
SIZE
CORP.
5000 W. CHANDLER BLVD.
CHANDLER, ARIZONA 85226
SCALE
FSCM NO.
DRAWING NO.
REV
APVD BY
APVD BY
CHK B
DWN BY
DSGN BY
DATE
DATE
DATE
DATE
DATE
ANGLES
ZONE
REV
DESCRIPTION
DATE
APPROVED
PREVIOUS
SH
REV
15
14
16
C
D
E
F
G
H
J
K
L
M
N
P
R
T
12.00 REF
12.00 REF
1.00 REF
15.00 ±0.25
15.00 ±0.25
0.80 ±0.05
0.40 ±0.10
0.36 ±0.04
1.56 ±0.19
17.00 ±0.20
17.00 ±0.20
–A–
–B–
¤
¢
¢
–C–
//
A
0.127
//
C
0.15
0.15
A
0.127
0.30
AB
0.60
0.40
1.00
1.00
1.00 REF
C
S
PIN #1 I.D.
1.0 DIA
45
˚
CHAMFER
4 PLACES
¢ 1.0
3 PLACES
30
˚
3
SEATING PLANE
T
2
S
S
BOTTOM VIEW
256 SOLDER BALLS
TOP VIEW
SIDE VIEW