Intel STRONGARM SA-1100 User Manual
Page 16
xvi
SA-1100 Developer’s Manual
Public Instructions ........................................................................................... 16-2
16.5.1 EXTEST (00000) ................................................................................ 16-3
16.5.2 SAMPLE/PRELOAD (00001) ............................................................. 16-3
16.5.3 CLAMP (00100) .................................................................................. 16-3
16.5.4 HIGHZ (00101) ................................................................................... 16-4
16.5.5 IDCODE (00110) ................................................................................ 16-4
16.5.6 BYPASS (11111) ................................................................................ 16-4
Test Data Registers ......................................................................................... 16-5
16.6.1 Bypass Register ................................................................................. 16-5
16.6.2 SA-1100 Device Identification (ID) Code Register.............................. 16-6
16.6.3 SA-1100 Boundary-Scan (BS) Register ............................................. 16-6
Register Summary ......................................................................................................... A-1
3.6864–MHz Oscillator Specifications............................................................................ B-1
System Specifications .......................................................................... B-1
B.1.1.1. Parasitic Capacitance Off-chip
Between PXTAL and PEXTAL................................................. B-2
B.1.1.2. Parasitic Capacitance Off-chip
Between PXTAL or PEXTAL and VSS .................................... B-2
Quartz Crystal Specification ................................................................. B-3
32.768–kHz Oscillator Specifications............................................................................. C-1
System Specifications ..........................................................................C-1
C.1.1.1. Temperature Range.................................................................C-1
C.1.1.2. Current Consumption...............................................................C-1
C.1.1.3. Startup Time ............................................................................C-1
C.1.1.4. Frequency Shift Due to Temperature Effect on the Circuit ......C-2
C.1.1.5. Parasitic Capacitance Off-chip
Between TXTAL and TEXTAL .................................................C-2
C.1.1.6. Parasitic Capacitance Off-chip
Between TXTAL or TEXTAL and VSS.....................................C-2
Quartz Crystal Specification .................................................................C-3
Internal Test ................................................................................................................... D-1