INFICON STC-2000A Thin Film Deposition Controller Operating Manual - Manual (Page 41)

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STC-2000A DEPOSITION CONTROLLER
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The specific functional runtime mode must be chosen: sequencing or non-sequencing. Either of
these modes can be further switched between the normal run mode and the test mode. This results in 4
mode choices:
sequencing/run, sequencing/test, non-sequencing/run, non-sequencing/test. Manual mode
(manual control of power) can be selected while a process is running by pressing the fixed front panel
MANUAL key with the pendent connected.
At the same time that these choices are being made, the programmable memory can be kept as it
is, purged or set to factory defaults. A memory change can effect film parameters, process steps, runtime
mode, system configuration, I/O programming, process accounting, and communication parameters.
Elsewhere in this manual (appears section 3.21) are tables and lists depicting memory element values after
purge and after factory [settings] are invoked. This memory information by itself is also listed later in this
section.
A film is programmed by selecting the film number (on the main menu), moving through the
associated parameter list, and changing the values as needed. Some of the film parameters are not
accessible or viable when another related film parameter predicates their availability. Up to 50 films can
be programmed. In non-sequencing mode, only 1 film can be run at a time, as there is only one implicit
process. In sequencing mode, a process can call for a film in a process step. There can be up to 99 steps in
a process and up to 9 processes. A process is menu programmed by building each line (step) with a mode
value, film number and thickness value.
In the non-sequencing mode, an active film must be menu selected (1 of 50). In the sequencing
mode, an active process must be menu selected (1 of 9). In either case, active indicates that this is the film
or process that will become active when the process starts (initiated by the front panel START key). In
addition, neither a film nor a process may be altered by editing when either is being used in a running
deposition (for safety reasons).
The optional memory module can be used to extend configurations.
Some system configuration parameters also determine the status of some film and map
parameters. Example configuration parameters that fall into this category are: need s/s card x and I/O slot
x type. Check the film parameter dependency list in section 1.8 to find the parameter of interest (all
parameters are listed there). Finally, set the status of the controlling parameter such that it allows the
parameter of interest to be accessible and appropriately set. Dependencies are also listed later in this
section.
There are some basic parameters that need to be setup. The Density and Z-Factor can be
obtained from table 4.1, in section 4.3 [Review Films menu]. Tooling [Review Source Sensor Map menu]
for crystals can be determined empirically by running a trial deposition and using the equation (this will be
found in section 4.2):
Tooling = 100 X (Substrate Thickness / Displayed Thickness).
Generally, Tooling is greater than 100% when the sensor sees less deposited material than the substrate
(e.g. the sensor is further from the evaporant source than the crystal sensor). Generally, Tooling is less than
100% when the sensor sees more deposited material than the substrate (e.g. the sensor is closer to the
evaporant source than the crystal sensor). If 2 crystal sensors are used (assuming the single sensor card is
installed), Start Xtal (crystal) must match the hardware and positioning used. Obviously, the two crystal
sensors cannot occupy the same space. Therefore each crystal sensor will have a different tooling factor.
Crystal sensor tooling is coordinated by the sensor map menu that selects the sensor along with other sensor
properties. The channel specific applicable Review SS Map menu parameter is CHx Tooling. There is
also a Master Tooling parameter (Review SS Map Menu) that can be used change the ratio of both the
crystal sensors simultaneously in addition to the individual channel tooling. This can be thought of as a
global offset or multiplier used to alter the tooling of both active crystal sensors. In any case, the Tooling
factor is the attempt to describe the ratio of deposited material between the crystal sensor and the substrate.
Max Power Limit, Deposit Rate, Soak Power Value, Power Ramp Time, Power Soak Time,
Setpoint thickness and time limits need to be described. With these parameters entered, the Test mode
could be utilized to check the process behavior. The Max Power indicators show when the Max Power
parameter has been exceeded (LCD alternates with MAX!). To reiterate, the TEST mode only effects the
crystal sensor information being processed, it does not effect anything else (this includes the control output
voltages). This is not the point at which to begin experiments with a live system. This section is meant to
provide a discussion of the issues to familiarize the user with functional themes. Please read further.
SECTION 2.XX page 41 of 292