Stc-2000a deposition controller – INFICON STC-2000A Thin Film Deposition Controller Operating Manual User Manual
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STC-2000A DEPOSITION CONTROLLER
y
the presence of 2 zeroes indicates that the sensor card is installed and enabled (by menu parameter) and in
an OFF condition.
general form:
XYYXZZ
where X=Letter Code, YY= starting XTAL%, ZZ= ending XTAL%
starting group
ending group
XTAL 1 A91A89 = Crystal 1 started a process as active at 91% life and ended a process as active at 89% life.
XTAL 3 A97F71 = Crystal 3 started a process as active at 97% life and ended a process as failed at 71% life.
XTAL 5 O00O00 = Crystal 5 started a process as OFF at zero% life and ended a process as OFF at zero%
life (00 usually indicates that no crystal is connected).
XTAL 7 O21O021 = Crystal 7 started a process as OFF at 21% life and ended a process as OFF at 21% life.
XTAL 8 O..O..
= Crystal 8 is OFF and has no supporting sensor card installed.
The vital parameters stored and displayed are:
RUN:
Run number - increments at the start of each process cycle (beginning at layer #1).**
DATE:
MMDDYY representation of date the film was started.
TIME:
The time of the start of the run (from the 24 hour clock of the STC-2000A).
P TIME:
Process time - the time from a Start initiation to end of the Film Process.
COMPLT:
Mode of completion of the deposition.
NORMAL
Normal completion of run
0 BHIE
Bus Hold interrupt error
TMPWR
Xtal failure occurred, run completed on time-power * INDEXR Indexer failure
BADXTL
Bad Xtal terminated run
INVSRC Invalid SRC
REMOTE
External input terminated run [input card or host port] INVSNS Invalid
SNS
KEYBRD
Front keypad STOP BUTTON terminated run
REM M1 Remote Aux 1
MAXPWR
MAX POWER limit exceeded, run terminated *
REM M2 Remote Aux 2
PENDNT
STOP button on Hand Controller terminated run
REM M3 Remote Aux 3
SAFE 1
User Interface Bd. Software watchdog
REM M4
Remote Aux 4
S4 BAD
Source Sensor card failure
SDY FL Quality failure, shutter delay
IO BAD
I/O card failure
NO QUL Bad quality, dep phase drops out
FILM#
Film # used
PROC#
Process# used
LAYER#
Layer # used
MAP#
Map#
used
SRC#
Source channel # used
P
O
CK
E
T#
Pocket # (of indexer) used
D TIME:
Deposition time - the time the source shutter is open in Minutes:Seconds format.
THICK:
Thickness at end of deposition in Angstroms.
RATE:
Deposition rate at end of deposition in Å/Sec.
POWER:
Deposition power for last three seconds of deposition in %.
LOOP:
Accumulated counts in the control quality accumulator. See Section 2.17 for a description of this
value.
XTAL 1:
The start and ending crystal percent life is shown. See letter code table below.
XTAL 2:
Same as above.
* programmable feature
** The letter T appears after the run# when the TEST mode was used.
Crystal % Life Letter Code Table
O = Off
M = Missing
A = Active
B = Standby
D = Dropped
S = Switched
F = Failed
Note: [STAB: Accumulated counts in the crystal stability accumulator not reported here. See 3
rd
STATUS screen.]
Purge will clear Process Accounting contents (see section 2.6, Factory Settings vs... and section 2.21,
Check Sum Validation).
SECTION 3.XX
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