Motorola DSP56012 - Manual (Page 46)

2-6 DSP56012 User’s Manual MOTOROLA
Signal Descriptions
Ground
2.3 GROUND
Table 2-3 Grounds
Ground Name Description
GND
P
PLL Ground —GND
P
is ground dedicated for PLL use. The connection should be
provided with an extremely low-impedance path to ground. V
CCP
should be
bypassed to GND
P
by a 0.1
µ
F capacitor located as close as possible to the chip
package.
GND
Q
Internal Logic Ground —GND
Q
is an isolated ground for the internal processing
logic. This connection must be tied externally to all other chip ground
connections. The user must provide adequate external decoupling capacitors.
GND
A
A Ground —GND
A
is an isolated ground for sections of the internal logic. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GND
D
D Ground —GND
D
is an isolated ground for sections of the internal logic. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GND
H
Host Ground —GND
H
is an isolated ground for the HI I/O drivers. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.
GND
S
Serial Host Ground —GND
S
is an isolated ground for the SHI I/O drivers. This
connection must be tied externally to all other chip ground connections. The user
must provide adequate external decoupling capacitors.