INFICON STC-2002 Thin Film Deposition Controller Operating Manual User Manual
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p STC-2002
DEPOSITION CONTROLLER
y
SECTION 3.XX
e page 113 of 276 ^
differentiation in that if it is followed by two periods, this means that there is no sensor card installed for
this crystal channel, otherwise the presence of 2 zeroes indicates that the sensor card is installed and
enabled (by menu parameter) and in an OFF condition.
general form:
XYYXZZ
where X=Letter Code, YY= starting XTAL%, ZZ= ending XTAL%
starting group
ending group
XTAL 1 A91A89 = Crystal 1 started a process as active at 91% life and ended a process as active at 89% life.
XTAL 3 A97F71 = Crystal 3 started a process as active at 97% life and ended a process as failed at 71% life.
XTAL 5 O00O00 = Crystal 5 started a process as OFF at zero% life and ended a process as OFF at zero%
life (00 usually indicates that no crystal is connected).
XTAL 7 O21O021 = Crystal 7 started a process as OFF at 21% life and ended a process as OFF at 21% life.
XTAL 8 O..O..
= Crystal 8 is OFF and has no supporting sensor card installed.
The vital parameters stored and displayed are:
RUN:
Run number - increments at the start of each process cycle (beginning at layer #1).**
DATE:
MMDDYY representation of date the film was started.
TIME:
The time of the start of the run (from the 24 hour clock of the STC-2002).
P TIME:
Process time - the time from a Start initiation to end of the Film Process.
COMPLT:
Mode of completion of the deposition.
NORMAL-
Normal completion of run
TMPWR-
Xtal failure occurred, run completed on time-power *
BADXTL-
Bad Xtal terminated run
REMOTE-
External input terminated run
KEYBRD-
Front keypad STOP BUTTON terminated run
MAXPWR-
MAX POWER limit exceeded, run terminated *
PENDNT-
STOP button on Hand Controller terminated run
FILM#
Film # used
PROC#
Process# used
LAYER#
Layer # used
MAP#
Map#
used
SRC#
Source channel # used
P
O
CK
E
T#
Pocket # (of indexer) used
D TIME:
Deposition time - the time the source shutter is open in Minutes:Seconds format.
THICK:
Thickness at end of deposition in Angstroms.
RATE:
Deposition rate at end of deposition in Å/Sec.
POWER:
Deposition power for last three seconds of deposition in %.
LOOP:
Accumulated counts in the control quality accumulator. See Section x2.17 for a
description of this value.
XTAL 1:
The start and ending crystal percent life is shown. See letter code table below.
XTAL 2:
Same as above.
XTAL 3:
Same as above.
XTAL 4:
Same as above.
XTAL 5:
Same as above.
XTAL 6:
Same as above.
XTAL 7:
Same as above.
XTAL 8:
Same as above.
* programmable feature
** The letter T appears after the run# when the TEST mode was used.
Note: [STAB: Accumulated counts in the crystal stability accumulator not reported here. See 2
nd
STATUS screen.]
Purge will clear Process Accounting contents (see section x2.6x, Factory Settings vs... and section x2.21,
Check Sum Validation).
Crystal % Life Letter Code Table
O = Off
M = Missing
A = Active
B = Standby
D = Dropped
S = Switched
F = Failed