Avago Technologies LSI53C895A - Manual (Page 331)

Package Diagrams 6-71
6.6.1 LSI53C895A vs. LSI53C895 Pin/Ball Differences
The LSI53C895A can be used as a drop-in replacement for the
LSI53C895. The LSI53C895A is packaged in a 208 PQFP and
alternatively a 272 BGA.
Note: The BGA package for the LSI53C895 is a 292 BGA with the
only difference being the center grid is 6 x 6 balls vs. the
LSI53C895A’s 272 BGA which has a center grid of
4 x 4 balls. The LSI53C895A 272 BGA can be dropped
onto a board that has been laid out for the LSI53C895
292 BGA with no changes to the board.
Some of the original LSI53C895 no-connections have been used for new
signals. In addition, several of the previous LSI53C895 signals have been
renamed, and some of them are no longer used and are now
no-connections.