Comtech EF Data CDM-760 - Manual (Page 315)

F–1
Appendix F. OPTIONAL HIGH-
SPEED PACKET PROCESSOR
F.1 High-Speed Packet Processor – Introduction
The High-Speed Packet Processor is an optional feature for the CDM-760 Advanced High-Speed
Trunking Modem. In addition to providing Layer 2 and Layer 3 functionality, it incorporates a
number of key features for Wide Area Network (WAN) bandwidth optimization. This includes
Header Compression, Quality of Service (QoS), and Static Routing.
The CDM-760 chassis features two rear panel slots that accommodate optional PIIC (Plug-in
Interface Card) synchronous traffic data modules. In place of PIICs, the CDM-760 can instead
accommodate the High-Speed Packet Processor option (Figure F-1). This option can be ordered
at time of initial purchase; the modem is shipped with the Packet Processor installed into the
chassis PCBs, with a rear chassis faceplate that is installed with #4-40 hex jack screws. It is also
available as a field upgrade kit (CEFD P/N KT-0020958).
Figure F-1. CDM-760 w/Optional High-Speed Packet Processor
F.1.1 High-Speed Packet Processor – Operational Requirements
F.1.1.1 Major Assemblies
High-Speed Packet Processor Option / Upgrade Kit KT-0020958
CEFD Part Number QTY Description
PL-0021603 1 High-Speed Packet Processor PCB Assembly
FP-0021300 1 Cover, Chassis
HW/SEM440X1/4PH 4 Screw, #4-40 x 1/4 LG Pan Head
HW/JS440M03 4 Screw, #4-40 x 5/16 LG Hex Jack