NEC PD17062 - Manual (Page 291)

291
µ
PD17062
26. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
µ
PD17062.
For details of the recommended soldering conditions, refer to our document SMD Surface Mount
Technology Manual (IEI-1207).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is
done under different conditions.
Table 26-1 Soldering Conditions for Surface-Mount Devices
µ
PD17062GC-
×××
-3BE: 64-pin plastic QFP (14
×
14 mm)
Symbol
IR35-207-1
VP15-207-2
–
Soldering process
Infrared ray reflow
VPS
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 ˚C
Reflow time: 30 seconds or less (at 210 ˚C or more)
Maximum allowable number of reflow processes: 1
Exposure limit Note : 7 days (20 hours of pre-baking is required at
125 ˚C afterward.)
Peak package’s surface temperature: 215 ˚C
Reflow time: 40 seconds or less (at 200 ˚C or more)
Maximum allowable number of reflow processes: 2
Exposure limit Note : 7 days (20 hours of pre-baking is required at
125 ˚C afterward.)
(1) Do not start reflow-soldering the device if its temperature is
higher than the room temperature because of a previous
reflow soldering.
(2) Do not use water for flux cleaning before a second reflow
soldering.
Terminal temperature: 300 ˚C or less
Heat time: 3 seconds or less (for each side of device)
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: Temperature of 25 ˚C and maximum relative humidity at 65% or less
Caution Do not apply more than a single process at once, except for “Partial heating method.”
Table 26-2 Soldering Conditions for Through Hole Mount Devices
µ
PD17062CU-
×××
: 48-pin plastic shrink DIP (600 mil)
Caution In wave soldering, apply solder only to the lead section. Care must be taken that jet solder does
not come in contact with the main body of the package.
Wave soldering
(only for leads)
Partial heating method
Soldering process Soldering conditions
Solder temperature: 260 ° C or less
Flow time: 10 seconds or less
Terminal temperature: 260
°
C or less
Heat time: 10 seconds or less