NEC PD78F9488 User Manual
Page 368
CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
368
User’s Manual U15331EJ4V1UD
Table 25-1. Surface Mounting Type Soldering Conditions (3/3)
(5)
µ PD789488GC-×××-8BT-A: 80-pin plastic QFP (14x14)
µ
PD78F9488GC-8BT-A:
80-pin plastic QFP (14x14)
µ
PD789489GC-
×××-8BT-A: 80-pin plastic QFP (14x14)
µ PD78F9489GC-8BT-A:
80-pin plastic QFP (14x14)
µ PD789488GK-×××-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9488GK-9EU-A:
80-pin plastic TQFP (fine pitch) (12x12)
µ
PD789489GK-
×××-9EU-A: 80-pin plastic TQFP (fine pitch) (12x12)
µ PD78F9489GK-9EU-A:
80-pin plastic TQFP (fine pitch) (12x12)
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared reflow
Package peak temperature: 260
°C, Time: 60 seconds max. (at 220°C
or higher), Count: Three times or less, Exposure limit: 7 days
Note
(after
that, prebake at 125
°C for 20 to 72 hours)
IR60-207-3
Wave soldering
When the pin pitch of the package is 0.65 mm or more, wave soldering
can also be performed.
For details, contact an NEC Electronics sales representative.
−
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
−
Note After opening the dry pack, store it at 25
°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1. Products that have the part numbers suffixed by "-A" are lead-free products.
2.
For soldering methods and conditions other than those recommended above, contact an NEC
Electronics sales representative.