Chapter 25 recommended soldering conditions – NEC PD78F9488 User Manual
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User’s Manual U15331EJ4V1UD
CHAPTER 25 RECOMMENDED SOLDERING CONDITIONS
The
µPD789489 subseries should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 25-1. Surface Mounting Type Soldering Conditions (1/3)
(1)
µ PD789488GC-×××-8BT: 80-pin plastic QFP (14x14)
µ
PD78F9488GC-8BT: 80-pin plastic QFP (14x14)
µ
PD789489GC-
×××-8BT: 80-pin plastic QFP (14x14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice or less
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice or less
VP15-00-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120°C max. (package surface temperature)
WS60-00-1
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
–
Caution Do not use different soldering methods together (except for partial heating).
(2)
µ PD789488GK-×××-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD78F9488GK-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
µ
PD789489GK-
×××-9EU: 80-pin plastic TQFP (fine pitch) (12x12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Interface reflow
Package peak temperature: 235
°C, Time:30 seconds max. (at 210°C or higher),
Count: Twice or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°C for
10 hours)
IR35-107-2
VPS
Package peak temperature: 215
°C, Time:40 seconds max. (at 200°C or higher),
Count: Twice or less, Exposure limit: 7 days
Note
(after that, prebake at 125
°C for
10 hours)
VP15-107-2
Partial heating
Pin temperature: 350
°C max., Time: 3 seconds max. (per pin row)
−
Note After opening the dry peak, store it at 25
°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).