Kontron COMe Starterkit Eval T2 - Manual (Page 6)

4.2. Super I/O............................................................................................................................ 168
5. COM Express Module Connectors.................................................................................169
5.1. Connector Descriptions....................................................................................................169
5.2. Connector Land Patterns and Alignment........................................................................169
5.3. Connector and Module CAD Symbol Recommendations..............................................170
6. Carrier Board PCB Layout Guidelines...........................................................................171
6.1. General............................................................................................................................... 171
6.2. PCB Stack-ups..................................................................................................................171
6.2.1. Four-Layer Stack-up......................................................................................................171
6.2.2. Six-Layer Stack-up........................................................................................................171
6.2.3. Eight-Layer Stack-up.....................................................................................................172
6.3. Trace-Impedance Considerations....................................................................................173
6.4. Trace-Length Extensions Considerations.......................................................................175
6.5. Routing Rules for High-Speed Differential Interfaces....................................................176
6.5.1. PCI Express Trace Routing Guidelines.........................................................................178
6.5.2. USB Trace Routing Guidelines......................................................................................179
6.5.3. USB 3.0 Trace Routing Guidelines................................................................................180
6.5.4. PEG Trace Routing Guidelines......................................................................................180
6.5.5. SDVO Trace Routing Guidelines...................................................................................181
6.5.6. DisplayPort Trace Routing Guidelines...........................................................................182
6.5.7. LAN Trace Routing Guidelines......................................................................................183
6.5.8. Serial ATA Trace Routing Guidelines.............................................................................184
6.5.9. LVDS Trace Routing Guidelines....................................................................................185
6.6. Routing Rules for Single Ended Interfaces.....................................................................186
6.6.1. PCI Trace Routing Guidelines.......................................................................................187
6.6.2. IDE Trace Routing Guidelines.......................................................................................188
6.6.3. LPC Trace Routing Guidelines......................................................................................189
7. Mechanical Considerations............................................................................................190
7.1. Form Factors.....................................................................................................................190
7.2. Heatspreader.....................................................................................................................191
7.2.1. Top mounting.................................................................................................................192
7.2.2. Bottom mounting............................................................................................................193
7.2.3. Materials........................................................................................................................193
8. Applicable Documents and Standards..........................................................................195
8.1. Technology Specifications...............................................................................................195
8.2. Regulatory Specifications................................................................................................197
8.3. Useful books......................................................................................................................198
9. Appendix A: Deprecated Features.................................................................................199
9.1. TV-Out................................................................................................................................ 199
9.1.1. Signal Definitions...........................................................................................................199
9.1.2. TV-Out Connector..........................................................................................................199
9.1.3. TV-Out Reference Schematics......................................................................................201
PICMG ® COM Express ® Carrier Board Design Guide Rev. 2.0 / December 6, 2013
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