Kontron COMe Starterkit Eval T2 - Manual (Page 185)

Carrier Board PCB Layout Guidelines
6.5.5. SDVO Trace Routing Guidelines
Table 64: SDVO Trace Routing Guidelines
Parameter Trace Routing
Transfer Rate / SDVO Lane Up to 2.0 GBit/s
Maximum signal line length
(coupled traces) 7 inches
Signal length used on COM Express Module
(including the Carrier Board connector) 2 inches
Signal length allowance for the COM Express Carrier
Board 5 inches to SDVO device
Differential Impedance 100 Ω +/-20%
Single-ended Impedance 55 Ω +/-15%
Trace width (W) PCB stack-up dependent
Spacing between differential pairs (intra-pair) (S) PCB stack-up dependent
Spacing between pairs-to-pair Min. 20mils
Spacing between differential pairs and high-speed
periodic signals Min. 50mils
Spacing between differential pairs and low-speed non
periodic signals Min. 20mils
Length matching between differential pairs
(intra-pair) Max. 5mils
Length matching between differential pairs
(inter-pair) Keep difference within a 2.0 inch delta.
Length matching between differential signal pair and
differential clock pair Max. 5mils
Spacing from edge of plane Min. 40mils
Via Usage Max. 4 vias per differential signal trace
AC coupling capacitors AC coupling capacitors on the signals 'SDVO_INT+' and
'SDVOINT-' have to be implemented on the customer COM
Express Carrier Board, if the device is directly located on the
Carrier Board. When using a slot at the Carrier Board the
capacitors are located at the addon card.
Capacitor type: X7R, 100nF +/-10%, 16V, shape 0402.
PICMG ® COM Express ® Carrier Board Design Guide Rev. 2.0 / December 6, 2013
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