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Echelon Series 6000 Chip databook User Manual

Page 54

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FT 6000

Smart Transceiver

U1

FT 5000

SVC~

1

IO0

2

IO1

3

IO2

4

IO3

5

VDD1V8

6

IO4

7

VDD3V3

8

IO5

9

IO6

10

IO7

11

IO8

12

IO

9

13

IO

10

14

IO

11

15

VDD

1

V

8

16

TRST

~

17

VDD

3

V

3

18

TCK

19

TMS

20

TDI

21

TDO

22

XIN

23

XOUT

24

VDDPLL

25

GNDPLL

26

VOUT1V8

27

RST~

28

VIN3V3

29

VDD3V3

30

AVDD3V3

31

NETN

32

AGND

33

NETP

34

NC

35

GND

36

TXON

37

RXON

38

CP

4

39

CS

0

~

40

VDD

3

V

3

41

VDD

3

V

3

42

SDA

_

CS

1

~

43

VDD

1

V

8

44

SCL

45

MISO

46

SCK

47

MOSI

48

GND

49

Figure 12. Connections for the Ground Pins

Connect the VDDPLL pin (25) to the VOUT1V8 pin (27), with an associated chip ferrite

bead, as shown in Figure 13. Connect the GNDPLL pin (26) to GND, with an associated

chip ferrite bead. In addition, add stabilizing capacitors across the VDDPLL and GNDPLL

pins. Place each capacitor directly adjacent to the PLL pins, on the top layer of the PCB.

C1
0.01 uF

1

2

C2
0.1 uF

1

2

L1

BEAD

1

2

L2

BEAD

1

2

GNDPLL

VDDPLL

VOUT1V8

Figure 13. Connections for the PLL Pins

In the figure, the capacitors are:

C1: 0.01 µF Ceramic

C2: 0.1 µF Ceramic

The chip ferrite beads should be rated for ≥50 mA saturation current, provide ≥120 Ω

impedance at 100 MHz per 20 ºC, and have a DC resistance ≤1 Ω. An example part is the

Laird Technologies

®

LI0603E151R-10 part (formerly a Steward part).

Connect a 1 to 10 kΩ pull-up resistor to the JTAG TCK pin (19), as shown in Figure 14.

42

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