Echelon Series 6000 Chip databook User Manual
Page 10
Summary of the Available I/O Objects ..................................................... 101
Programming Considerations.................................................................... 113
Application Program Development ........................................................... 114
IzoT NodeBuilder Development Tool ........................................................ 114
Development Hardware Setup ........................................................... 114
Release Hardware Setup ..................................................................... 115
Supported Commands ......................................................................... 116
Migrating from earlier Neuron Chips ....................................................... 117
Migrating Self-Installation Routines ................................................. 117
Checklist 1: Series 6000 Chip Connections .............................................. 120
Checklist 2: FT 6000 Smart Transceiver Connections ............................ 122
Checklist 3: Neuron 6000 Processor Connections .................................... 123
Checklist 5: Device PCB Layout ............................................................... 125
Checklist 6: Network Cabling and Termination ...................................... 126
Checklist 7: Device Programming ............................................................. 127
Qualified TP/FT-10 Cable Specifications ................................................ 129
Category 5 and 6 Cable Specifications ............................................... 131
NEMA Type 4 Cable Specifications .................................................... 131
16 AWG (1.3 mm) “Generic” Cable Specifications ............................. 133
FT-X3 Communications Transformer ...................................................... 135
Transformer Electrical Connections ......................................................... 137
Handling and Manufacturing Guidelines ............................................... 141
Termination of Unused Pins ............................................................... 142
Avoidance of Damaging Conditions .................................................... 143
Electrostatic Discharge Design Guidelines ........................................ 145
Power Supply, Ground, and Noise Considerations ........................... 145
Decoupling Capacitors ......................................................................... 146
Board Soldering Considerations ............................................................... 146
Recommended Solder Profile .............................................................. 146
Soldering Surface Mount (SMT) Parts ............................................... 147
General ESD Handling Guidelines ........................................................... 147
Power Distribution and Decoupling Capacitors ....................................... 151
Recommended Bypass Capacitor Placement ............................................ 151
Basic Electrical Connections ............................................................... 156
Memory Interface Connections ........................................................... 157
Transformer Connections .................................................................... 157
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