Echelon Series 6000 Chip databook - Manual (Page 22)

Description Specification
Reflow soldering temperature profile Refer to Joint Industry Standard document
IPC/JEDEC J-STD-020D.1 (March 2008)
Peak reflow soldering temperature 260 ºC
Package type 48-pin QFN
RoHS compliant Yes
EMI
Designed to comply with FCC Part 15 Subpart B and
EN 55022 Level B
ESD Designed to comply with EN 61000-4-2, Level 4
Radiated Electromagnetic
Susceptibility
Designed to comply with EN 61000-4-3, Level 3
Fast Transient/Burst Immunity Designed to comply with EN 61000-4-4, Level 4
Surge Immunity Designed to comply with EN 61000-4-5, Level 3
Conducted RF Immunity Designed to comply with EN 61000-4-6, Level 3
Table 5 summarizes the specifications for the FT-X3 Communications Transformer.
Table 5. FT-X3 Communications Transformer Specification Summary
Description Specification
Operating humidity 25-90% RH @50 °C, non-condensing
Non-operating humidity 95% RH @ 50 °C, non-condensing
Vibration 1.5 g peak-to-peak, 8 Hz to 2 kHz
Mechanical shock 100 g (peak)
Reflow soldering temperature profile Refer to Joint Industry Standard document
IPC/JEDEC J-STD-020D.1 (March 2008)
Peak reflow soldering temperature 245 ºC
10 Introduction