Rockwell Automation 2098-IPD-xxx Ultra5000 Intelligent Positioning Drives Installation Manual - Manual (Page 24)

Publication 2098-IN001E-EN-P — April 2002
1-10 Installing Your Ultra5000
Bonding Your System
Bonding is the practice of connecting metal chassis, assemblies,
frames, shields and enclosures to reduce the effects of electromagnetic
interference (EMI).
Bonding Modules
Unless specified, most paints are not conductive and they act as
insulators. To achieve a good bond between modules and the
subpanel, surfaces need to be paint-free or plated. Bonding metal
surfaces creates a low-impedance exit path for high-frequency energy.
Improper bonding blocks that direct exit path and allows
high-frequency energy to travel elsewhere in the cabinet. Excessive
high-frequency energy can effect the operation of other
microprocessor controlled equipment. The illustrations that follow
(refer to
Figure 1.3 ) show details of recommended bonding practices
for painted panels, enclosures, and mounting brackets.
Figure 1.3
Recommended Bonding Practices
Stud-mounting the subpanel
to the enclosure back wall
Stud-mounting a ground bus
or chassis to the subpanel
Subpanel Welded stud
Scrape
Flat washer
If the mounting bracket is coated
with a non-conductive material
(anodized, painted, etc.), scrape
the material around the mounting
hole.
Star washer
Nut
Nut
Flat washer
Mounting bracket or
ground bus
Use a wire brush to remove paint
from threads to maximize ground
connection.
Back wall of
enclosure
Welded
stud
Subpanel
Star washer
Use plated panels or scrape
paint on front of panel.
Subpanel
Nut
Nut
Star washer
Flat washer
Star washer
Star washer
Scrape paint on both sides
of panel and use star
Tapped
Bolt
Flat washer
Ground bus or
mounting bracket
If the mounting bracket is coated
with a non-conductive material
(anodixed, painted, etc.), scrape
the material around the mounting
Bolt-mounting a ground bus or chassis to the back-panel