2 transducer specifications (optional), 3 xiu (crystal interface unit) specifications – INFICON XTC/C Thin Film Deposition Controller User Manual
Page 25
1 - 9
IP
N 07
4-
18
3X
XTC/C - XTC/2 Operating Manual
1.3.2 Transducer Specifications (optional)
1.3.3 XIU (Crystal Interface Unit) Specifications
The XTC/2 Series instruments use a new type of "passive intelligent" oscillator.
It is available with cable lengths of 15’ (4.572 m), 30’ (9.144 m), 50’ (15.24 m),
and 100’ (30.28 m) as IPN 757-305-G15, G30, G50, or G100, respectively.
Conventional, active style oscillators do not work with these instruments.
In-vacuum cable lengths to a maximum of 2 m (6.6’) are supported with this new
technology.
Max. Bakeout
Temperature*
Size (Max. Envelope)
Water Tube &
Coax Length
Body & Holder
IPN
CrystalSix Sensor
130 °C
3.5" dia. x 2.0" high
(89 mm dia. x 51 mm high)
30" (762 mm) 304 SS (plate,
holders, & mate-
rial shield)**
750-446-G1
Standard Sensor
130 °C
1.063" x 1.33" x .69" high
(27 mm dia. x 34 mm x 17.5 mm high)
30" (762 mm) 304 SS
750-211-G1
Standard Sensor
with Shutter
130 °C
1.06" x 2.24" x .69" high
(27 mm dia. x 57 mm x 17.5 mm high)
30" (762 mm) 304 SS
750-211-G2
Sputtering Sensor
105 °C
1.36" dia. x .47" high
(34.5 mm dia. x 11.8 mm high)
30" (762 mm) Au-plated BeCu
007-031
Compact Sensor
130 °C
1.11" x 1.06" x 1.06" high
(28 mm x 27 mm x 27 mm high)
30" (762 mm) 304 SS
750-213-G1
Compact Sensor
with Shutter
130 °C
2.08" x 1.62" x 1.83" high
(53 mm x 41 mm x 46 mm high)
30" (762 mm) 304 SS
750-213-G2
UHV Bakeable
Sensor
450 °C
1.35" x 1.38" x .94" high
(34 mm x 35 mm x 24 mm high)
12" (305 mm)
20" (508 mm)
30" (762 mm)
304 SS
007-219
007-220
007-221
UHV Bakeable
Sensor with Shutter
400 °C
1.46" x 1.37" x 1.21" high
(37 mm x 35 mm x 31 mm high)
12" (305 cm)
20" (508 cm)
30" (762 cm)
304 SS
750-012-G1
750-012-G2
750-012-G3
Dual Sensor
130 °C
1.45" x 3.45" x 1.70" high
(37 mm x 88 mm x 43 mm high)
30" (762 mm) 304 SS
750-212-G2
Shutter Assembly
400 °C
two models available
N/A
300-series SS
750-210-G1
750-005-G1
(Sputtering)
*For Bake only; waterflow is required for actual deposition monitoring. These temperatures are conservative maximum
device temperatures, limited by the properties of Teflon (PTFE) at higher temperatures. In usage, the water cooling allows
operation in environments that are significantly elevated, without deleterious affects.
**Aluminum body for heat transfer.