Toshiba Magnia 3310 - Manual (Page 76)

Installing and Removing Hardware
Installing and removing optional devices 58
When installing/removing components, work in a place where
there is low humidity, minimal dust and no direct sunshine.
The installation or removal of an optional device should be
carried out at ambient temperatures of 50 to 95°F (10 to
35°C) for pedestal models, or 50 to 89°F (10 to 32°C) for
rack models, and at ambient humidity of 30 to 80%. Avoid a
place where the temperature may change sharply, because it
may cause condensation inside the equipment.
When installing or removing optional units, be sure to wear a
wristband to discharge static electricity and attach a clip to the
metal frame. If no wristband is available, touch the unpainted
metal frame of the system to discharge static electricity from
your body before touching any items.
Carefully handle options whose boards are not covered such
as expansion cards because they are easily affected by static
electricity. When holding an option with the board exposed,
hold it any position other than the edges (metal plated sec-
tion) and prevent contact with the components.
After taking a device out of the antistatic package, put it hori-
zontally with the components side up on a grounded plane
free from static electricity. After taking out a device, keep the
antistatic packing case for future use. Do not slide the server
for relocation.
Proceed with the installing/removing process in the correct
order.
There are a few kinds of screws used or to be used. Restore
the screw to its original position.