ZyXEL Communications Multi-service Access Platform MSAP2000 - Manual (Page 200)

7. Product Specification
MSAP2000 Technical Manual V3.0 7-93
QEToP Specification
Local Processor WINBOND W90N740
Flash ROM Flash EPROM(4MB)
Hardware
RAM SRAM (32MB)
Insertion Loss 0.25dB nominal
0.5dB maximum
Minimum Isolation 16dB
Wavelength 1310nm +/- 20nm
1550nm +/- 20nm
Connector LC x 3
Input Power 5VDC/3A
Power
Consumption 1.1W@25°C
Environment Operation Temperature and
0°C to +60°C
Humidity Up to 95% relative humidity
Storage Temperature and -10°C to +80°C
Humidity Up to 95% relative humidity
Height 213 ± 1mm
Width 18 ± 1mm
Depth 257 ± 1mm
Dimension
Weight 470 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1