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ZyXEL Communications Multi-service Access Platform MSAP2000 User Manual

Page 200

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7. Product Specification

MSAP2000 Technical Manual V3.0

7-93

QEToP Specification

Local Processor

WINBOND W90N740

Flash ROM

Flash EPROM(4MB)


Hardware

RAM SRAM

(32MB)

Insertion Loss

0.25dB

nominal

0.5dB

maximum

Minimum Isolation

16dB

Wavelength

1310nm +/- 20nm

1550nm +/- 20nm

Connector

LC x 3

Input Power

5VDC/3A

Power
Consumption

1.1W@25°C

Environment

Operation Temperature and

0°C to +60°C

Humidity

Up to 95% relative humidity

Storage Temperature and

-10°C to +80°C

Humidity

Up to 95% relative humidity

Height

213 ± 1mm

Width

18 ± 1mm

Depth

257 ± 1mm

Dimension

Weight

470 ± 2 g


EMI

CNS 13438 or CISPR 22


ESD

IEC 61000-4-2 Class 1