ZyXEL Communications Multi-service Access Platform MSAP2000 - Manual (Page 191)

7. Product Specification
MSAP2000 Technical Manual V3.0 7-84
ETH Specification
Microprocessor Winbond W90N740
Flash ROM Flash EPROM(1MB)
Hardware
RAM SRAM (2MB)
Ethernet Interface Module Capacity 1 Channels
Connector
Flow Control Front Access J45 MDI, MDI-X
802.3x flow control
Package Size Up to 1536 bytes
Max. Transmission Speed 16.384 Mbps
Step Adjustment speed 64 kbps
Package Mapping HDLC encapsulation (Bit
stuffing)
Input Power 5 VDC/1.2A
Power
Consumption 6W@25°C
Environment Operation Temperature and
0°C to +60°C
Humidity Up to 95% relative humidity
Storage Temperature and -10°C to +80°C
Humidity Up to 95% relative humidity
Height 213 ± 1mm
Width 18 ± 1mm
Depth 257 ± 1mm
Dimension
Weight 303 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1