ZyXEL Communications Multi-service Access Platform MSAP2000 - Manual (Page 167)

7. Product Specification
MSAP2000 Technical Manual V3.0 7-60
GSH Specification
Microprocessor Winbond W90N740
Flash ROM Flash EPROM(1MB)
Hardware
RAM SRAM (2MB)
G.SHDSL Interface Line Code 16 Leel TC PAM (TC PAM 16)
Symbol Rate
Frame (Data Rate+8000)/3 Symbol/sec
Complies with ITU-T G.991.2
Standards
Test Impedance 135 Ω, Resistance
Handshake Standard Complies with ITU-T G.991.2
and ITU-T G.994.1 Standards
Loopback Testing Local Loopback
Remote Loopback
Remote Payload Loopback
Input Power 5VDC/1.4A
-48VDC/20mA (Sealing)
Power
Consumption 4W@25°C
Environment Operation Temperature and
0°C to +60°C
Humidity Up to 95% relative humidity
Storage Temperature and -10°C to +80°C
Humidity Up to 95% relative humidity
Height 213 ± 1mm
Width 18 ± 1mm
Depth 257 ± 1mm
Dimension
Weight 356 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1