ZyXEL Communications Multi-service Access Platform MSAP2000 - Manual (Page 130)

7. Product Specification
MSAP2000 Technical Manual V3.0 7-23
MLTM Specification
Microprocessor WINBOND W90N740
Flash ROM Flash (2MKB)
Hardware
RAM SRAM (2MB)
DSP ZyXEL’s DSP implemetaion
Test Items Dial Channel Stage 2
Dial Tone Stage 1 & 3
DTMF Test Stage 3
V-Port Testing Stage 1 & 3
Line Number Test Stage 3
Wrong Line Test Stage 1 & 3
Howler Voice Stage 3
Copper Test Stage 1 & 3
Copper Test Parameter Range Accuracy
Incoming AC Voltage (50~500Hz) 0~200 Vrms ± (15%+1dgts)
Incoming DC Voltage 0~±200 V ± (15%+1dgts)
Loop Resistance (Without
Incoming Voltage) 0~3 K Ω ± (10%+1dgts)
Isolated Resistance (DC Test
Voltage
≥48V)
10K Ω ~ 1MΩ ± (10%+1dgts)
Capacity 0.1~5 µF ± (10%+1dgts)
Input Power -48VDC/1.2A
Power
Consumption 17.9W@25°C (During Testing)
Environment Operation Temperature and
0°C to +60°C
Humidity Up to 95% relative humidity
Storage Temperature and -10°C to +80°C
Humidity Up to 95% relative humidity
Height 213 ± 1mm
Width 18 ± 1mm
Depth 257 ± 1mm
Dimension
Weight 380 ± 2 g
EMI
CNS 13438 or CISPR 22
ESD
IEC 61000-4-2 Class 1