Teledyne LeCroy Summit T3-16 PCIe Multi-lane Protocol Analyzer User Manual - Manual (Page 30)

Teledyne LeCroy Using Interposers
18 Summit T3‐16 PCI Express Multi‐Lane Protocol Analyzer User Manual
Figure 3.12: Connecting the Summit T3-16 Analyzer to the Device Under Test Using a Gen3
Interposer
3.8.9 Summit T3-16 Components
Summit T3‐16 components used in the installation are:
 iPass Y‐Cable: The cable supports eight lanes from two directions. Side A of the
probe cable connects to the Upstream port on the Analyzer (on the left in the
photo above), and Side B of the probe cable connects to the Downstream port
(on the right).
Note: x16 recordings require two cables.
 Summit T3‐16 x16 Slot Gen3 Interposer: The slot Interposer provides the point
of attachment for the Analyzer to the Device Under Test (DUT). The Interposer is
designed to fit between a motherboard and one of its device cards ‐ for exam‐
ple, a LAN card. The Interposer has three sets of connectors: a gold male connec‐
tor that fits into a standard x16 PCI Express slot on a motherboard, a PCIe female
connector that accepts a x16 PCI Express device, and two Interposer cable con‐
nectors that connect the Interposer to the Analyzer.
3.8.10 Installing the Gen3 Interposer
To install the Interposer, perform the following steps:
1. Insert the gold male connector on the Interposer probe into a x16 PCI Express slot in
the motherboard. Interposers are available in x1, x4, x8, and x16 versions.
2. Insert the PCI Express DUT into the Interposer’s PCIe female device connector.
3. The slot Interposer is shipped from Teledyne LeCroy with a metal face plate for
attachment to the host machine’s enclosure.