Kontron TIGH2U Carrier Grade Server - Manual (Page 3)

Kontron Carrier Grade Server TIGH2U
December 2009 Product Guide, rev.1.2
3
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Contents—TIGH2U Server
Contents
1 Introduction ..............................................................................................................8
1.1
About this Manual ...............................................................................................8
1.1.1
Manual Organization .................................................................................8
1.2 What Your Server Includes ...................................................................................9
1.3 Product Accessories .............................................................................................9
1.4 Additional Information and Software .................................................................... 10
2 Features .................................................................................................................. 11
2.1
Server Components ........................................................................................... 13
2.2 Back Panel ....................................................................................................... 14
2.3 Front Panel....................................................................................................... 15
2.4 Rear Panel Ethernet Ports................................................................................... 18
2.5 SAS Front Panel (SFP) Board .............................................................................. 18
2.5.1
SFP Board Features ................................................................................ 18
2.6 Telco Alarms Manager Board............................................................................... 18
2.6.1
TAM Board Features ............................................................................... 19
2.7 Server Board Connector and Component Locations ................................................ 19
2.8 Hard Disk Drives ............................................................................................... 20
2.9 Riser Card Assembly .......................................................................................... 21
2.9.1
Full-Height PCI-X/PCIe Riser Card............................................................. 21
2.9.2 Low-Profile PCIe Riser Card ..................................................................... 21
2.10 Power Supply.................................................................................................... 22
2.11 System Cooling................................................................................................. 22
2.11.1 CPU 1 and Memory Cooling Area .............................................................. 23
2.11.2 CPU 2 and Chipset Cooling Area ............................................................... 23
2.11.3 PCI Cooling Area .................................................................................... 23
2.11.4 Hard Disk Drive and Power Supply Cooling................................................. 23
2.11.5 Fan Speed Control.................................................................................. 23
2.11.6 Cooling Summary................................................................................... 24
2.12 Hardware Requirements ..................................................................................... 24
2.12.1 Processor .............................................................................................. 24
2.12.2 Memory ................................................................................................ 24
3 Server Component Installations and Upgrades ........................................................ 25
3.1
Before You Begin............................................................................................... 25
3.1.1
Tools and Supplies Needed ...................................................................... 25
3.1.2 System References................................................................................. 25
3.2 General Installation Procedures ........................................................................... 25
3.2.1
Removing the Front Bezel........................................................................ 25
3.2.2 Installing the Front Bezel......................................................................... 26
3.2.3 Removing the Chassis Cover .................................................................... 26
3.2.4 Installing the Chassis Cover..................................................................... 27
3.2.5 Removing the Processor Air Duct.............................................................. 28
3.2.6 Installing the Processor Air Duct............................................................... 29
3.3 Hot-Swappable Component Installation Procedures ................................................ 30
3.3.1
Installing or Replacing a Hard Drive .......................................................... 30
3.3.1.1
Removing a Hard Drive Tray....................................................... 30
3.3.1.2 Attaching a Hard Drive to the Drive Tray...................................... 31
3.3.2 Replacing a Power Supply........................................................................ 32
3.3.2.1
Removing the Power Supply Module ............................................ 33
3.3.2.2 Installing a Power Supply Module ................................................ 33
3.3.2.3 Installing or Replacing a DC Power Supply.................................... 34
3.3.2.4 Grounding a DC-Powered System................................................ 34