Rockwell Automation 2097-Vxxx Kinetix 350 Single-axis EtherNet/IP Servo Drive User Manual - Manual (Page 25)

Rockwell Automation Publication 2097-UM002A-EN-P - December 2013 25
Install the Kinetix 350 Drive System Chapter 2
Electrical Noise Reduction This section outlines best practices that minimize the possibility of noise-related
failures as they apply specifically to Kinetix 350 system installations. For more
information on the concept of high-frequency (HF) bonding, the ground plane
principle, and electrical noise reduction, refer to the System Design for Control
of Electrical Noise Reference Manual, publication
GMC-RM001 .
Bonding Drives
Bonding is the practice of connecting metal chassis, assemblies, frames, shields,
and enclosures to reduce the effects of electromagnetic interference (EMI).
Unless specified, most paints are not conductive and act as insulators. To achieve
a good bond between drive and the subpanel, surfaces need to be paint-free or
plated. Bonding metal surfaces creates a low-impedance return path for high-
frequency energy.
Improper bonding of metal surfaces blocks the direct return path and lets high-
frequency energy travel elsewhere in the cabinet. Excessive high-frequency energy
can effect the operation of other microprocessor controlled equipment.
IMPORTANT To improve the bond between the drive and subpanel, construct your subpanel
out of zinc plated (paint-free) steel.