Comtech EF Data SDM-300A User Manual
Page 8
SDM-300A Satellite Modem
Revision 6
Preface
MN/SDM300A.IOM
iv
2.2
Decription of the Modulator .......................................................................................................................2–5
2.2.1
Theory of Operation .............................................................................................................................2–6
2.2.2
Theory of Modulation Types.................................................................................................................2–7
2.3
Description of the Demodulator ................................................................................................................2–8
2.4
Description of the Decoder ......................................................................................................................2–10
2.5
Description of the Interface .....................................................................................................................2–11
2.5.1
Available Interfaces............................................................................................................................2–13
2.5.2
Plesiochronous/Doppler/Buffer...........................................................................................................2–13
2.5.3
Closed Network..................................................................................................................................2–14
2.5.4
Open Network ....................................................................................................................................2–14
2.6
Backward Alarm Theory and Connections.............................................................................................2–15
CHAPTER 3.
INSTALLATION/UPGRADES.....................................................................................................3–1
3.1
Unpacking....................................................................................................................................................3–1
3.2
Installation...................................................................................................................................................3–2
3.3
Software and Hardware Installation/Upgrades.........................................................................................3–4
3.3.1
Overhead Interface PCB Installation....................................................................................................3–4
3.3.2
Hardware Upgrades .............................................................................................................................3–6
3.4
Reed-Solomon PCB ....................................................................................................................................3–6
3.4.1
Unpacking ............................................................................................................................................3–6
3.4.2
Installation............................................................................................................................................3–6
3.5
Turbo Codec Installation............................................................................................................................3–8
3.5.1
Unpacking ............................................................................................................................................3–8
3.5.2
Installation............................................................................................................................................3–9
3.6
Duplex Reed-Solomon Codec Installation..............................................................................................3–13
3.7
Data I/O Interface Connector (J8) Removal/Installation ........................................................................3–17
3.7.1
Data I/O Connector (J8) Removal......................................................................................................3–17
3.7.2
Data I/O Connector (J8) Installation...................................................................................................3–18
3.8
Hardware Upgrades ..................................................................................................................................3–20
3.8.1
Main PCB Firmware Chips.................................................................................................................3–20
3.8.2
Overhead Interface PCB ....................................................................................................................3–22