Northern Connectors Harting DIN 41 612 Connectors - Manual (Page 24)

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THT soldering technology
Proven over decades, standard soldering technologies
deliver maximum stability and process reliability. The
soldering pins of the connectors are inserted into the
through-plated PCB holes and can then be soldered
simultaneously with other components in a wave soldering
process.
SMC soldering technology
The connector is inserted into through-plated PCB holes
similar to standard component assembly for processing
with SMC (Surface Mount Compatible) soldering
technology. Insertion of these SMT components can
be automated by means of Pick & Place assembly in
preparation for a reflow soldering process together with
the surface-mounted component.
This connection technology is characterized by high
mechanical strength and is facilitated by a design that is
specially adapted to the reflow soldering process (high-
temperature materials).
Press-in technology
This solder-free connection technology is based on press-
in mounting of a pin in a throughplated PCB hole. The
implementation of a state-of-the-art, flexible press-fit zone
allows for the compensation of tolerances of PCB holes
and meets high electrical and mechanical requirements
for properties such as low press-in forces and high holding
forces.
Press-in technology supports unlimited cost efficient
processing, especially of pins with selective gold plating
for backplane bus systems.
Wire wrap terminals
This solder-free connection technology is based on a wire,
which is wrapped with several turns onto a rectangular
post. When wires are correctly wrapped the connection
performs with low resistance, mechanical strength
and high reliability, unaffected by normal climatic or
temperature change.
Terminations
You will find more detailed information on the following pages.
Wire wrap terminals
Press-in technology
THT soldering technology
SMC soldering technology