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4 lan routing guideline, 1 impedance, Table 4-21: lan impedance consideration – IEI Integration ICE-DB-9S User Manual

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ICE Module

4.11.4 LAN Routing Guideline

4.11.4.1 Impedance

Table 4-21: LAN Impedance Consideration

Parameters

Routing

Transfer Rate

1.0 Gbits/sec

Maximum signal line length (coupled traces)

8.0 inches specified by COM Express "

Signal length used on COM Express module
(including the carrier board connector) "

3.0 inches specified by COM Express "

Signal length allowance for the COM Express
carrier board "

5.0 inches to the magnetics module

Maximum signal length between isolation
magnetics module and RJ-45 connector on the
carrier board

1.0 inch

Differential Impedance

95 Ohms +/-20%

Single-ended Impedance

55 Ohms +/-15%

Spacing between RX and TX pairs (inter-pair) (s)

Min. 50mils

Spacing between differential pairs and high-speed
periodic signals

Min. 300mils

Spacing between differential pairs and low-speed
non periodic signals

Min. 100mils

Length matching between differential pairs
(intra-pair)

Max. 5mils

Length matching between RX and TX pairs
(inter-pair)

Max. 30mils

Spacing between digital ground and analog ground
plane (between the magnetics module and RJ-45
connector)

Min. 60mils

Spacing from edge of plane

Min. 40mils

Via Usage

Max. of 2 vias on TX path Max. of 2
vias on RX path