IEI Integration ICE-DB-9S - Manual (Page 118)

Page 105
ICE Module
6.6.2 Air Follow Issue
The air flow of the IEI COM Express fan module must be considered when installing a
COM Express system. Please refer to Figure 6-11 for air flow consideration.
6.6.3 Grounding Issue
The mounting holes on all ICE COM modules are connected to digital circuit ground
(GND) for improved EMC performance. Using conductive screws and distance
keepers will also connect the heat spreader and attached heat sink to GND. In some
applications the heat sink or heat spreader will be directly screwed with the inner
surface of the chassis. In some cases, however, it may not be desirable to have a
direct connection of circuit ground (GND) and chassis ground through the heat sink
and / or heat spreader. System designers should take this into account when defining
system grounding.
6.7 Others Kits Specification
6.7.1 Heat Sink
IEI provides a standard heat sink specially designed for COM Express module. The
fan in the heat sink can be removed if the fan is not needed.
Figure 6-11: IEI Heat Sink Module Dimensions