IEI Integration ICE-DB-9S - Manual (Page 116)

Page 103
ICE Module
All dimensions are in mm. X-Y tolerances shall be ± 0.3mm [±0.012"].
The interior holes at coordinates (40, 40) and (80, 40) are tapped through holes with a
M2.5 thread. The interior holes do not receive standoffs. These holes may be sealed
on the module side by an adhesive backed foil, or they may be blind tapped holes with
a minimum thread depth of 2.5 mm. They are intended to allow additional attachment
points to the heat-spreader from outside the module.
Figure 6-9: IEI Heat Spread Module
6.6 Design Notes
6.6.1 Component Height — Module Back and Carrier Board Top
Parts mounted on the backside of the module (in the space between the bottom
surface of the module PCB and the Carrier Board) shall have a maximum height of 3.8
mm (dimension ‘B’ in Figure 6-11). With the 5 mm stack option, the clearance
between the Carrier Board and the bottom surface of the module’s PCB is 5 mm
(dimension ‘A’ in Figure 6-11). Using the 5 mm stack option, components placed on
the Carrier Board topside under the module envelope shall be limited to a maximum
height of 1 mm (dimension ‘C’ in Figure 6-11), with the exception of the mating
connectors. Using Carrier Board topside components up to 1mm allows a gap of 0.2
mm between Carrier Board module bottom side components. This may not be
sufficient in some situations. In Carrier Board applications in which vibration or board
flex is a concern, then the Carrier Board component height should be restricted to a
value less than 1mm that yields a clearance that is sufficient for the application. If the
Carrier Board uses the 8 mm stack option (dimension ‘A’ in Figure 6-11), then the