IEI Integration ICE-DB-9S - Manual (Page 10)

ICE Module
Page x
Figure 4-27: LCD Power Sequence Example(Refer to AUO G150XG01).................................63
Figure 4-28: Audio Analog Power Example ...............................................................................66
Figure 4-29: IDE Reference Design.............................................................................................67
Figure 4-30: CF Connector ..........................................................................................................68
Figure 4-31: CompactFlash® Reference Design .......................................................................68
Figure 4-32: TV Out Schematic Reference .................................................................................70
Figure 4-33: Giga Lan Connection Exampel (including Transformer) ....................................72
Figure 4-34: Clock Buffer.............................................................................................................75
Figure 4-35: Windbond W83627EHG Reference Design...........................................................76
Figure 4-36: Keyboard/Mouse Reference Schematic................................................................77
Figure 4-37: RS-232 Reference Schematic ................................................................................77
Figure 4-38: LPT Reference Schematic ......................................................................................78
Figure 4-39: Floppy Reference Schematic.................................................................................78
Figure 4-40: IR Reference Schematic .........................................................................................79
Figure 4-41: VGA Connector D-SUB15 .......................................................................................80
Figure 4-42: VGA Reference Design ...........................................................................................81
Figure 4-43: Speaker Out Reference Schematic .......................................................................84
Figure 4-44: FAN Reference Schematic .....................................................................................84
Figure 4-45: RTC Reference Schematic .....................................................................................85
Figure 5-1: Four Layers Stack .....................................................................................................88
Figure 5-2: Six Layers Stack........................................................................................................89
Figure 5-3: ATX Power Delivery Block Diagram........................................................................92
Figure 5-4: ATX Power On Sequence .........................................................................................92
Figure 5-5: AT Power Delivery Block Diagram ..........................................................................93
Figure 5-6: AT Power On Sequence............................................................................................94
Figure 6-1: Module Connector Picture .......................................................................................97
Figure 6-2: Carrier Board Connector ..........................................................................................97
Figure 6-3: Single Connector Physical Dimensions .................................................................98
Figure 6-4: Dual Connector Footprint and Alignment ..............................................................98
Figure 6-5: Compact, Basic and Extended Form Factor ....................................................... 100
Figure 6-6: Overall Height for Heat-Spreader in Basic and Extended Modules .................. 101
Figure 6-7: Basic Module Heat-Spreader ................................................................................ 102
Figure 6-8: Basic Module Heat-Spreader Footprint ............................................................... 102
Figure 6-9: IEI Heat Spread Module ......................................................................................... 103
Figure 6-10: Component Clearances Underneath Module .................................................... 104
Figure 6-11: IEI Heat Sink Module Dimensions ...................................................................... 105
Figure 6-12: IEI Heat Sink Module Picture .............................................................................. 106