IEI Integration ICE-DB-9S - Manual (Page 112)

Page 99
ICE Module
The COM Express PnP Initiative strongly recommends to use the following
location
peg hole tolerances instead of those indicated in the footprint drawings from
the
COM Express Specification as shown above:
• 0.8mm +0.075/-0.025mm
• 1.5mm +0.075/-0.025mm
6.4 COM Express Form Factors
The COM Express specification was developed by the PCI Industrial Computer
Manufacturing Group (PICMG) in close collaboration with many leading companies
across the embedded industry in order to find an implementation solution to handle
upcoming new high speed serial I/Os, processors and chipsets. COM Express
specifies two form factors, as well as five different types of connector pinouts. The two
form factors are referred to as Basic and Extended. The Basic module footprint is
125mm x 95mm and focuses on space-constrained, low power systems which
typically do not contain more than one horizontal mounted SO-DIMM. The Extended
footprint is slightly larger at 155mm x 110mm and supports up to two full size, vertically
mounted DIMM modules to accommodate larger memory configurations for
high-performance CPUs, chipsets and multiprocessor systems. The placement of the
shielded 220-pin connectors and the mounting holes are identical between these two
footprints.