IEI Integration ICE-DB-9S - Manual (Page 7)

ICE Module
Page vii
4.14 M ISCELLANEOUS ..............................................................................................82
4.14.1 Signal Description ....................................................................................82
4.14.2 Speaker/FAN Control/RTC Reference .......................................................84
4.14.2.1 Speaker Out........................................................................................84
4.14.2.2 FAN Control.......................................................................................84
4.14.2.3 RTC ....................................................................................................85
5 PCB STACK AND POWER DELIVER DESIGN ............................................86
5.1 C HAPTER O VERVIEW ...........................................................................................87
5.2 M ICROSTRIP OR S TRIPLINE ..................................................................................87
5.3 PCB S TACKUP E XAMPLE ....................................................................................87
5.3.1 Four-Layer Stack-up ...................................................................................88
5.3.2 Six-Layer Stack-up ......................................................................................88
5.4 ATX P OWER D ELIVERY G UIDELINES ..................................................................90
5.4.1 ATX Power Status (S0,S3,S4,S5,G3)...........................................................91
5.4.2 ATX Power Diagram...................................................................................92
6.3.3 ATX Power On Timing................................................................................92
5.5 AT P OWER D ELIVERY G UIDELINE ......................................................................93
5.5.1 AT Power Diagram .....................................................................................93
5.5.2 AT Power On Timing ..................................................................................94
6 MECHANICAL DESIGN GUIDELINES ............................................................95
6.1 C HAPTER O VERVIEW ...........................................................................................96
6.2 COM M ODULE AND C ARRIER B OARD C ONNECTOR ............................................96
6.2.1 Module Connector ......................................................................................96
6.2.2 Carrier Board Connector ...........................................................................97
6.3 C ONNECTOR F OOTPRINT .....................................................................................98
6.4 COM E XPRESS F ORM F ACTORS ..........................................................................99
6.5 H EAT S PREAD ....................................................................................................100
6.6 D ESIGN N OTES ..................................................................................................103
6.6.1 Component Height — Module Back and Carrier Board Top.................... 103
6.6.2 Air Follow Issue........................................................................................105
6.6.3 Grounding Issue........................................................................................105
6.7 O THERS K ITS S PECIFICATION ............................................................................105
6.7.1 Heat Sink ...................................................................................................105
A ICE MODULE DESIGN SCHEMATIC CHECK LIST .................................. 107
B APPLICATION NOTES...................................................................................... 116