Figure 5-8: basic module heatspreader footprint – IEI Integration ICE-DB-T6 User Manual
Page 90
Type 6 Carrier Board Design Guide
Page 80
Figure 5-8: Basic Module Heatspreader Footprint
All dimensions are in mm. X-Y tolerances shall be ± 0.3mm [±0.012"].
The interior holes at coordinates (40, 40) and (80, 40) are tapped through holes with a
M2.5 thread. The interior holes do not receive standoffs. These holes may be sealed on
the module side by an adhesive backed foil, or they may be blind tapped holes with a
minimum thread depth of 2.5 mm. They are intended to allow additional attachment points
to the heatspreader from outside the module.
See also other documents in the category IEI Integration Hardware:
- SPCIE-5100DX (180 pages)
- SPCIE-C2060 v1.01 (200 pages)
- SPCIE-C2060 v2.12 (212 pages)
- SPCIE-C2160 (204 pages)
- SPCIE-C2260-i2 (217 pages)
- ROCKY-3786 v4.0 (175 pages)
- ROCKY-3786 v4.10 (147 pages)
- PCIE-Q350 v1.00 (272 pages)
- PCIE-Q350 v1.12 (250 pages)
- PCIE-Q350 v1.20 (250 pages)
- PCIE-Q350 v1.30 (213 pages)
- PCIE-Q57A (159 pages)
- PCIE-G41A2 (151 pages)
- PCIE-Q670 v1.03 (206 pages)
- PCIE-Q670 v2.00 (205 pages)
- PCIE-H610 (181 pages)
- PCIE-Q870-i2 (217 pages)
- IOWA-LX-600 (159 pages)
- PCISA-945GSE v1.01 (207 pages)
- PCISA-945GSE v1.10 (190 pages)
- PCISA-9652 v1.00 (232 pages)
- PCISA-9652 v1.01 (232 pages)
- PCISA-PV-D4251_N4551_D5251 (145 pages)
- PICOe-945GSE (197 pages)
- PICOe-GM45A (198 pages)
- PICOe-PV-D4251_N4551_D5251 v1.00 (154 pages)
- PICOe-PV-D4251_N4551_D5251 v1.10 (154 pages)
- PICOe-PV-D4251_N4551_D5251 v1.11 (155 pages)
- PICOe-B650 (156 pages)
- PICOe-HM650 (174 pages)
- HYPER-KBN (139 pages)
- SPXE-14S (3 pages)
- SPXE-9S v1.00 (5 pages)
- SPXE-9S v1.1 (6 pages)
- SPE-9S v1.00 (4 pages)
- SPE-9S v1.1 (5 pages)
- SPE-6S (3 pages)
- SPE-4S (4 pages)
- PE-6SD3 (4 pages)
- PE-6SD2 v4.0 (4 pages)
- PE-6SD2 v2.10 (3 pages)
- PE-6SD (3 pages)
- PE-6S3 v1.0 (2 pages)
- PE-6S3 v4.0 (4 pages)
- PE-6S2 (4 pages)