IEI Integration ICE-DB-T6 - Manual (Page 78)

Type 6 Carrier Board Design Guide
Page 68
4.3.1 Four-Layer Stack-up
Figure 4-1 below is an example of a four layer stack-up. Layers L1 and L4 are used for
signal routing. Layers L2 and L3 are used for solid ground and power planes respectively.
Microstrips on Layers 1 and 4 reference ground and power planes on Layers 2 and 3
respectively. It may be advantageous to swap the GND and PWR planes in some cases.
This allows Layer 4 to be GND referenced. Layer 4 is clear of parts and may be the
preferred primary routing layer.
Figure 4-1: Four-Layer Stack
4.3.2 Six-Layer Stack-up
Figure 4-2 below is an example of a six layer stack-up. Layer L1, L3, L4 and L6 are used
for signal-routing. Layer L2 and Layer L5 are power and ground planes respectively.
Microstrips on Layer 1 and Layer 6 reference solid ground and power planes on Layers 2