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IEI Integration ICE-DB-T6 User Manual

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Type 6 Carrier Board Design Guide

Page IX

Figure 3-27: VGA Connector D-SUB15 .......................................................................................60

Figure 3-28: VGA Reference Design ...........................................................................................62

Figure 3-29: Speaker Out Reference Schematic .......................................................................64

Figure 3-30: RTC Reference Schematic .....................................................................................64

Figure 3-31: Fan Reference Schematic ......................................................................................65

Figure 4-1: Four-Layer Stack.......................................................................................................68

Figure 4-2: Six-Layer Stack .........................................................................................................69

Figure 4-3: ATX Power Delivery Block Diagram........................................................................72

Figure 4-5: AT Power Delivery Block Diagram ..........................................................................72

Figure 5-1: Module Connector Picture .......................................................................................75

Figure 5-2: Carrier Board Connector ..........................................................................................75

Figure 5-3: Single Connector Physical Dimensions .................................................................76

Figure 5-4: Dual Connector Footprint and Alignment ..............................................................76

Figure 5-5: Compact, Basic and Extended Form Factor ..........................................................78

Figure 5-6: Overall Height for Heatspreader in Basic and Extended Modules ......................79

Figure 5-7: Basic Module Heatspreader .....................................................................................79

Figure 5-8: Basic Module Heatspreader Footprint ....................................................................80

Figure 5-9: IEI Heat Spread Module ............................................................................................81

Figure 5-10: Component Clearances Underneath Module .......................................................82

Figure 5-11: IEI Heat Sink Module Dimensions .........................................................................83

Figure 5-12: IEI Heat Sink Module Picture .................................................................................83

Figure B-1: BIOS Main Menu (BIOS Version: MR10).................................................................89

Figure B-2: AFUWIN – Open BIOS File .......................................................................................89

Figure B-3: Locate BIOS File .......................................................................................................90

Figure B-4: Check Program All Block.........................................................................................90

Figure B-5: AFUWIN – Flash........................................................................................................91

Figure B-6: BIOS Main Menu – Updated BIOS Version (MR11) ...............................................91

Figure B-7: USB Flash Drive and BIOS Updating Files ............................................................92

Figure B-8: BIOS Updating File Directory ..................................................................................92

Figure B-9: GO Command ...........................................................................................................93

Figure B-10: BIOS Update Complete (DOS)...............................................................................93

Figure B-11: BIOS Main Menu – Updated BIOS Version (MR11) .............................................94