IEI Integration ICE-DB-T6 - Manual (Page 9)

Type 6 Carrier Board Design Guide
Page IX
Figure 3-27: VGA Connector D-SUB15 .......................................................................................60
Figure 3-28: VGA Reference Design ...........................................................................................62
Figure 3-29: Speaker Out Reference Schematic .......................................................................64
Figure 3-30: RTC Reference Schematic .....................................................................................64
Figure 3-31: Fan Reference Schematic ......................................................................................65
Figure 4-1: Four-Layer Stack.......................................................................................................68
Figure 4-2: Six-Layer Stack .........................................................................................................69
Figure 4-3: ATX Power Delivery Block Diagram........................................................................72
Figure 4-5: AT Power Delivery Block Diagram ..........................................................................72
Figure 5-1: Module Connector Picture .......................................................................................75
Figure 5-2: Carrier Board Connector ..........................................................................................75
Figure 5-3: Single Connector Physical Dimensions .................................................................76
Figure 5-4: Dual Connector Footprint and Alignment ..............................................................76
Figure 5-5: Compact, Basic and Extended Form Factor ..........................................................78
Figure 5-6: Overall Height for Heatspreader in Basic and Extended Modules ......................79
Figure 5-7: Basic Module Heatspreader .....................................................................................79
Figure 5-8: Basic Module Heatspreader Footprint ....................................................................80
Figure 5-9: IEI Heat Spread Module ............................................................................................81
Figure 5-10: Component Clearances Underneath Module .......................................................82
Figure 5-11: IEI Heat Sink Module Dimensions .........................................................................83
Figure 5-12: IEI Heat Sink Module Picture .................................................................................83
Figure B-1: BIOS Main Menu (BIOS Version: MR10).................................................................89
Figure B-2: AFUWIN – Open BIOS File .......................................................................................89
Figure B-3: Locate BIOS File .......................................................................................................90
Figure B-4: Check Program All Block.........................................................................................90
Figure B-5: AFUWIN – Flash........................................................................................................91
Figure B-6: BIOS Main Menu – Updated BIOS Version (MR11) ...............................................91
Figure B-7: USB Flash Drive and BIOS Updating Files ............................................................92
Figure B-8: BIOS Updating File Directory ..................................................................................92
Figure B-9: GO Command ...........................................................................................................93
Figure B-10: BIOS Update Complete (DOS)...............................................................................93
Figure B-11: BIOS Main Menu – Updated BIOS Version (MR11) .............................................94